Electronics Forum: tin lead silver bga reliability (Page 3 of 6)

Lead-free BGA in Tin/Lead Process

Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell

Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).

Tin Lead Silver BGAs

Electronics Forum | Tue Apr 26 09:29:26 EDT 2016 | davef

I've got good news and bad news: GOOD: I love Ag2 solder it's the best, most well behaved, reliable, couldn't ask for a better general purpose solder. BAD: It's leaded. I'd be concerned about embrittlement issues when soldering to gold that was 10 t

No Lead BGA Hot Gas Rework

Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken

I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col

Lead Free ...

Electronics Forum | Tue Aug 31 22:03:30 EDT 2004 | KEN

If you have control over your design (as in an OEM) ENTEK can be a managable alternative. IF your like me (a CM), you get one of everything ever imagined. There has been much ado with ENTEK. Not every product is apropriate. For instance I have cu

ROHS 6/6 BGA device in Non-ROHS reflow

Electronics Forum | Mon Oct 18 11:43:42 EDT 2010 | hegemon

Use the forums nice search feature above. "Lead Free BGA" Lots of info. In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your

Tin Lead BGAs in leadfree paste

Electronics Forum | Sun Mar 12 01:58:44 EST 2006 | grantp

Hi, We have been soldering lead free BGA's onto products with lead based paste, and we have had no increase in defects at all. We have used a standard lead paste profile, so we are not altering the temps anything from what's recommended by the paste

Sn/Pb diffusion

Electronics Forum | Mon Apr 29 22:32:59 EDT 2002 | davef

See, I didn�t bite on you zinc diffusion trick that you tried to pull last week. Understand, in this response, I am NOT trying to bust you. I�m trying to determine what you are looking to understand. [Some times I get so locked into talking a cert

Tin Lead BGAs in leadfree paste

Electronics Forum | Mon Mar 13 10:45:44 EST 2006 | muse95

The original issue was Co. does not need to go Pbfree, but some BGA's they use are only available Pbfree. They don't want to throw away Pb BGA stock, so some boards might have a combination of both Pb and Pbfree BGAs. The question basically was Shou

Time for the green flag to come down?

Electronics Forum | Fri Sep 22 16:21:31 EDT 2006 | patrickbruneel

Figure 1. Human Toxicity Potential, Life-cycle Comparison Tin/lead solder paste is the top formula. SAC is second from the bottom.3 RoHS Report Excludes Comparisons By George A. Riley, contributing editor A European Union (EU) Commission for Envir

Tin Lead BGAs in leadfree paste

Electronics Forum | Tue Mar 07 14:18:32 EST 2006 | James

Billy, I have to disagree with you. We inadvertently soldered a Pb BGA with SAC305 paste and then had it micro sectioned and spectrum analyzed. Imagine our surprise when we saw the spectrum analysis showed Pb. The micro sections showed none to ac


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