Electronics Forum | Fri May 15 21:59:42 EDT 1998 | Earl Moon
| Hi, | There has been a lot of disputes in our company | about changing present HASL to another Finishing | which can provide more flatter pad surface in fine | pitch applications. ( perhaps Ni/Au, OSP ) | The target is to reduce solder defects, t
Electronics Forum | Mon Jun 23 04:00:43 EDT 2003 | Paul Cooper
Hi there There are a number of things worth considering when viewing bga's. Firstly, like any other solder joint that you have been inspecting for years, suface finish is critical. Secondly, and again like other joints shape is important. Now it may
Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W
There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.
Electronics Forum | Fri Dec 04 13:25:34 EST 1998 | Jeff Sanchez
| | | | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. |
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian
| | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a
Electronics Forum | Fri Sep 17 10:09:17 EDT 1999 | Earl Moon
| | | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However,
Electronics Forum | Thu Aug 24 15:12:29 EDT 2000 | Earl Moon
I don't entertain the forum like JAXSUN. I never have played games but for some humorous insights. I, when participating, never complained until management provided only more incentive to advertisers than forum members. That said, the following is a
Electronics Forum | Thu Jan 08 16:16:09 EST 2004 | Dean
My first concern would be the choice of solder paste you have. There are better chemistries out there that far exceed the capabilities of the 609 2. Yes, the part will partially float on the solder (assuming plastic qfp). Cross sectioning would sho
Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel
This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********
