Electronics Forum | Tue Dec 08 12:44:52 EST 2020 | janwillemreusink
Who is using two sorts of tin in one selective soldering machine with to solder pots? So then the soldering program selects the correct pot (tin). What are the risks? Adding wrong tin in the wrong pot. Mixing up the nozzles?
Electronics Forum | Thu Dec 17 18:24:37 EST 2020 | SMTA-64387520
We use both in our selective soldering machine. Training is the most important concern. As long as you have well trained operators the risk is minimized.
Electronics Forum | Thu Dec 10 12:12:40 EST 2020 | robl
Yep, done it previously with a multipot machine. Using with wirefeed to top up the pots means you only have a contamintion risk when you fit a new top up reel. Used separate nozzles for both, but theoretically using titanium nozzles would mean no c
Electronics Forum | Mon Jul 14 08:22:09 EDT 2008 | scottp
It really doesn't matter that military has an exemption. They're still stuck with the same tin whisker risk since the component manufacturers have switched to service the consumer electronics market which are their large volume customers. The same i
Electronics Forum | Thu May 07 19:29:40 EDT 2009 | kareal
Hi Davef, Do you means it is natural for tin diffusion to copper trace during SMT process? but I could not detect tin in UHAST T=0 unit, and the tin diffusion was found only in copper trace of C4 cage. Two question: 1) Could you tell me which pr
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Mon Oct 03 10:41:57 EDT 2011 | patrickbruneel
Some of us here attended the 5th CALCE international symposium on tin whiskers http://www.calce.umd.edu/symposiums/ISTW2011.htm where one of my former professors, Dr. Henning Leidecker, talked about the tin whiskers he and the others at NASA Godda
Electronics Forum | Mon Sep 23 14:08:38 EDT 2002 | rocco
Hello My question is if the diferent types of allows that components manufacturers have considered like SnAg,SnCu,SnBi,NiPd,etc for platings instead Pb Have special handling at storage,floor handling and re-using as well as reworking ... Consideri
Electronics Forum | Tue Dec 14 09:32:59 EST 2004 | patrickbruneel
Hi Paul, One thing I can tell you for sure "lead free" is not going to solve your problem, because spectrum analysis have shown that dendrites at there final stage always consists of pure tin. The higher the tin content the higher the risk for dead
Electronics Forum | Sat May 02 23:31:06 EDT 2009 | kareal
Thanks davef. The defect always occurred during UHAST reliability, but not find in reflow. The key is that there is tin diffuse to copper trace under solder mask. is it a "normal" board defect and what is the potential risk for device? thanks!
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