Electronics Forum | Thu Mar 15 06:26:26 EST 2001 | Sal
Sorry for the lack of information provided, I'll try again : Test Points are the one's that are not soldering. The test points are round in geometry, 0.5MM(metric) in diameter with a HASL finish.The test point are no different to the ed through hole
Electronics Forum | Wed Apr 20 18:13:32 EDT 2005 | greg york
With twenty five machines working with the LFB227/S on our little island it does seem to work well. Wetting is good compared to Tin/Copper and flow is comparable to 63/37. Biggest problem sticking 3 - 4 % Ag in a solder ignoring the patents and royal
Electronics Forum | Thu Oct 23 12:50:28 EDT 2008 | gregoryyork
Hi Dave sorry not been back the Tin/P regenerator is controlled amounts of Phos additive that metallurgically reduces the dross. We do not recommend chemical methods for dross reduction as many salts/chemicals used could be hygroscopic in nature and
Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef
Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c
Electronics Forum | Thu Jan 12 11:25:06 EST 2006 | Cmiller
We tested SAC305 in our selective solder machine and found the dross production made it an unnaceptable choice of alloy. Personaly, I cant imagine dross in a joint being a good thing but if it is a very small amount and does not occur very often, y
Electronics Forum | Wed Jan 25 13:04:47 EST 2023 | proceng1
We have only had our Juki about 6 months, but it seems to be a great machine so far. For nitrogen, we have a couple generators. Minimum purity is Tin/Lead = 99.99% RoHS = 99.995% Of course five-9s is better. I do notice a difference in the LEAD F
Electronics Forum | Mon Jun 18 17:41:07 EDT 2001 | genny
Hi, I put this on the technet forum, and I know some of the same people are here, but I thought I might catch others here as well. We have PCB's which are populated at the CM level with no-clean solder paste. However in house we use a solder wire s
Electronics Forum | Fri Sep 17 15:01:05 EDT 1999 | Dave F
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Tue Jun 08 14:16:49 EDT 1999 | Dave F
| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl
Electronics Forum | Mon Aug 20 15:53:52 EDT 2007 | erhard
Manufacturing already tried to get a design change but no chance. I guess because the designer is afraid the components could get bent too much if they are mounted with a stand off. Of course everyone who has to manufacture this fist sais: why don't
