Electronics Forum | Tue Feb 26 05:10:17 EST 2008 | adetuc
Thanks for the reply Hege, I calibrate the machines every 3 months and have checked that the board carrier to nozzle parralelism is ok. Have tried many different profile settings using a MOLE for readings but still collapsing on one corner. I did
Electronics Forum | Tue Nov 09 17:26:13 EST 1999 | Dave F
Horace: You weren't real specific about the set-up of the two machines. So what's the diff man?? Big dross generators are: 1 R Woodgate says that pump speed is the biggest driver to dross production 2 Chrys uses low dross cast bar: Alpha HiFlo 3
Electronics Forum | Wed Jun 25 09:51:51 EDT 2014 | iam09
Hi Sirs, We are running Tin Lead process and we have boards that required clean and no clean process which have different flux application in our wave process. We are looking into opportunity to use common flux system for both clean and no clean an
Electronics Forum | Thu Mar 18 09:25:27 EST 2004 | remullis
Normally when I run into having to hit the ESC key to step through this is the steps I take. 1. Power machine down and restart. 2. Home machine and watch cutter carefully. Both cutter should acuate and the height motors should run CW and CCW. 3. You
Electronics Forum | Tue Jun 08 15:04:06 EDT 1999 | JohnW
| | | Hi,my master | | | How to iron out such soldering bridge with below conditions: | | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | | 3.using s
Electronics Forum | Fri Jun 29 14:15:00 EDT 2001 | stefo
This is a question about complying with J-STD-001 solderability testing. Do any of you have your vendors certify that the components and PCB's that you buy from them comply with the solderabilty requirements spelled out in the -002 and -003, in lieu
Electronics Forum | Mon Feb 25 11:12:32 EST 2008 | hegemon
It sounds more as though you have a profiling problem primarily, however, if your placement is not square to the board, then you should get your machine setup correct first. After that you can get to the profiling. If the BGA is brought up to tempe
Electronics Forum | Wed Sep 16 08:46:50 EDT 1998 | Chrys
Hi Folks, Need to draw upon the vast expertise in this forum... Whenever you fill a new wave solder machine with fresh bar solder, it seems to produce more than the normal amount of dross for a few weeks. I always understood this to be the solder "c
Electronics Forum | Thu Jun 30 18:40:06 EDT 2005 | KEN
What your asking has many variables. 1. Material: SS vs. Cast Iron. Iron is thicker. Which SS? 316, 316L 2. Pump speeds, turbulence, hours of operation directly affect equipment life. 3. Things like scraping the pots, the tunnels, impelle
Electronics Forum | Fri Jul 08 09:57:31 EDT 2005 | fctassembly
Proy, Another issue is what exact formulation of SAC is used. Much of the SAC305 being used in Asia contains phosphorus, which is added in an attempt to reduce the heavy drossing that SAC305 produces. Phosphorus acts as a flux on steel so will increa
