Electronics Forum | Mon Apr 26 17:12:14 EDT 2004 | babe
Take a solder iron with some wire solder and attempt to tin the leads of the component. Look under magnifier or microscope. Did they wet? If not try fluxing them with liquid flux and then soldering again. Did they wet? If they did not then you may wa
Electronics Forum | Wed Sep 27 23:52:28 EDT 2006 | fctassembly
Hello Steve, Yes, there are differences in the various alloys and I have described briefly below these differences: SN100- a common name for 100% tin that is used to increase the tin content in 63/37. SN100C-Name for Tin/Copper/Nickel/Germanium all
Electronics Forum | Tue Apr 20 19:34:13 EDT 2004 | Ken
ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.
Electronics Forum | Fri Oct 16 21:17:04 EDT 1998 | Scott McKee
| | With current soldering of stranded wires to pcb assy's the wire tends to be very brittle and can break with very little movement of the wire. We use a low residue cored wire. Anybody with advice or who has seen a similar problem/knows how to over
Electronics Forum | Thu Sep 21 21:00:21 EDT 2000 | Dave F
Well, I'm going to assume you: * Have a nichel barrier between the copper on your board and the gold / solder solution * Use a lead / tin near euthectic solder If so, I pick "C" - It doesn't matter. When concerned about copper tin intermetallics, t
Electronics Forum | Mon May 12 23:28:33 EDT 2003 | dehlers
To the best of my knowledge and experience the 2 % Ag component is not for embrittlement but rather to reduce gold scavenging caused by the propensity for tin to react with the gold. I have seen eutectic tin/lead actually disolve gold wire after a f
Electronics Forum | Thu May 05 03:22:38 EDT 2005 | Hannu
I do not mean big, heavy transformers but rather small ferrite core transformers, with ferrites in the range of EF16 .. EF40. The weight of the lead and its percentage of the total weight is not the issue here. We simply do not want lead-containing t
Electronics Forum | Thu Mar 04 17:10:19 EST 1999 | Earl Moon
| Our vendor proposed to supply us with shields made out of Cold Rolled Steel (CRS) electroplated with Sn (50 - 150 minches). Should I be concerned with solderability or are there a better alternatives to tin finish? | No matter the base metal, elec
Electronics Forum | Tue Jan 25 14:25:47 EST 2000 | Mark Miller
Has any one experienced hand soldering through hole components to white tin plated PCB's using no-clean wire solder? Our facility is presently evaluating white tin vs Sn/Pb coatings. Our only difficulty at this time has been hand soldering of wires
Electronics Forum | Wed May 04 11:54:29 EDT 2005 | HOSS
Rob, Are you hinting that the lead content of this component with dipped tin/lead solder would not be an issue with RoHS? If so, our understanding is that the legislation requires that the 6 banned substances cannot exist at greater than X% in any
