Electronics Forum | Thu Sep 02 18:39:48 EDT 2004 | steveg
We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning w
Electronics Forum | Sat May 28 06:43:03 EDT 2005 | steve
I have the ability to offer both SAC and SN100C lead free alloys to my customer base. What might occur if a customer is already using SAC305 in their wave and they want to save money and go to SN100C. They now are mixing, tin,silver,copper with tin,c
Electronics Forum | Wed Nov 23 17:33:23 EST 2005 | adlsmt
Are the components 100% tin plated? Thats what we are buying and we have no problem at all soldering with the same profiles we always have used and we use the same alloy as you but different mfg. We have not had problems soldering tin plated parts wi
Electronics Forum | Thu Dec 08 13:17:31 EST 2005 | Amol Kane
during my researches for LF transition, a question being asked is -- why even consider immersion tin if it whiskers. does it really matter?, because during reflow, the Sn dissolves in the SAC solder alloy and does not exist in a "Sn whisker" formabl
Electronics Forum | Mon Dec 12 13:09:46 EST 2005 | Kris
do you intend to use Immersion tin as a PCB surface finish ? Then Whisker concern is as below if you do not past your test pads, the pads will be stressed when probed on a ICT or a flying probe tester. This is a POTENTIAL for whiskers There is a lo
Electronics Forum | Tue Dec 13 10:27:46 EST 2005 | patrickbruneel
Samir, This growth doesn't look like a tin whisker which are needle like and very fragile (they don�t bend they break). I have seen similar growth in the past in an EMS defect analyses with connectors in stressed conditions. The growth seen was sim
Electronics Forum | Mon Dec 12 14:04:33 EST 2005 | craigj
Hi All was wondering is there anything I should be aware of or look out for if using parts with SnBi (Pb free) lead plating with Sn/Pb/Ag solder paste? I was always lead to believe that mixng lead and bismuth caused problems or are the bismuth levels
Electronics Forum | Tue Dec 13 09:15:56 EST 2005 | Samir Nagaheenanajar
5% Bi results in less plasticity * Formation of low temperature (ternerary phases) not detected. I don't advocate the use of Bismuth, per se, but rather I'm just relaying info. that I learned this from a Lead-Free seminar that I attended at Riyadh
Electronics Forum | Tue Feb 14 03:58:17 EST 2006 | Rob
Yes, it's fine - as Pete says you have to replace certain parts & either get the pot recoated or a new one. We ran a "Lead free" 6622C from Vitronics Soltec on Tin Lead, then it was cleaned up, recoated and loaded with a no-lead alloy with no proble
Electronics Forum | Thu Mar 16 12:48:12 EST 2006 | russ
The copper based part is it copper that you are soldering to or did you tell us what the base material was for the lead. Generally all leads are plated with something such as Tin/Lead, palladium over nickel, tin, etc... You cannot solder to bare co