Electronics Forum | Mon Apr 29 10:07:00 EDT 2002 | geoff_goring
I need to find out about tin/lead diffusion and how this causes solderability problems in device lead-outs. This is not to be confused with an earlier thread of Zn/Pb diffusion - unfortunately this is was a typo.
Electronics Forum | Mon Apr 29 22:32:59 EDT 2002 | davef
See, I didn�t bite on you zinc diffusion trick that you tried to pull last week. Understand, in this response, I am NOT trying to bust you. I�m trying to determine what you are looking to understand. [Some times I get so locked into talking a cert
Electronics Forum | Fri May 10 17:50:25 EDT 2002 | davef
We chart the following: * Reflow: Time over liquidous +25�C * Wave: Contact time and track tin, copper, gold, and antimony in pot analysis.
Electronics Forum | Fri May 31 08:51:09 EDT 2002 | zanolli
Hello Dave, As related to connector mating interface, fretting corrosion is the oxidation of the contact points, causing high resistance across the interface. Fretting corrosion is caused my micromotions in the interface exposing the metalized conta
Electronics Forum | Mon Jun 10 22:14:49 EDT 2002 | davef
While they're '50 pitch', you need to think of 0402 as fine pitch parts. So, ENIG, imm silver, and imm tin finishes and probably OSP would be good choices. Stay away from HASL.
Electronics Forum | Sun Sep 15 21:44:41 EDT 2002 | jason
Hi Dave, Immersion Ag has poor surface appearances after reflow or rather tarnished, while Immersion Tin requries higher temp. Probably that's why Immersion Ag is more preferred.
Electronics Forum | Wed Sep 18 13:22:29 EDT 2002 | kevin
as the title says, should gold pads be pre-tinned, and are there any issues with soldering to gold pads?
Electronics Forum | Tue Dec 10 16:30:44 EST 2002 | Randy Villeneuve
Tin is pretty standard. I would doubt your leads are only Nickel plated as Nickel will oxidize very quickly.
Electronics Forum | Thu Dec 12 11:38:32 EST 2002 | MA/NY DDave
If you are thinking of putting one in place (I would say hire some people B>If you are just working with it (Than other approaches would be good. YiE, MA/NY DDave
Electronics Forum | Fri Feb 28 12:08:07 EST 2003 | davef
Paul We don't like to mix metals on press fits. Yano, we do gold on gold or solder on solder, but we don't mix metals [except with imm silver / tin] to avoid electrochemical corrosion. Is that bad information or does AMP think that's not a problem
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