Electronics Forum: tinning (Page 58 of 169)

Immersion gold and BGAs

Electronics Forum | Fri Aug 26 09:48:11 EDT 2005 | David

I have heard that there are problems using immersion gold on PCBs when working with BGAs. Is this correct? Is white tin more suitable?

solder strength

Electronics Forum | Thu Sep 08 14:03:50 EDT 2005 | chunks

You're right, but my neighbor borrowed my X-ray fluoroscope XRF and never brought it back! Actually, I just read the spec sheet which told me it was tin/silver leads.

solder strength

Electronics Forum | Thu Sep 08 14:25:20 EDT 2005 | kris

what did you reprofile to ? did you increase the peak reflow temperature ? can you tell form what to where ? I bet your vendor told you process guys that it was " drop in" for a tin leaded plated part.

Draining a Solder Pot-

Electronics Forum | Tue Sep 27 17:25:12 EDT 2005 | scombs

Hi Jay, Have you used those methods before? The muffin tin is a good idea as long as you buy enough. Thanks

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Wed Nov 02 03:35:09 EST 2005 | Slaine

I thought it was the tin content that leached the copper so presumed 100Sn would be more aggressive?

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Thu Nov 03 13:35:46 EST 2005 | Amol

the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Thu Jan 05 17:10:04 EST 2006 | russ

The CCGA packages that we install are still a tin/lead alloy and not a SAC alloy. They were 90/10 SN/PB. I beleive that this may be one reason why the difference.

BGA ball Separation

Electronics Forum | Tue Jul 25 11:30:47 EDT 2006 | DC

Russ, we had similiar issue on the corner seperation. The board is ENIG and the part is Altera FBGA 1020 (Super BGA) and reflowed by tin/lead paste. Please comment your concern on Altera parts! Is CTE mismatch?

what is the cause of green decay on the soldered wires

Electronics Forum | Thu Dec 08 18:59:04 EST 2005 | KEN

Is this a wire dip tinning process? If yes, then your flux is probably trapped under the insulator, causing corrosion. BAD BAD BAD (hopefully you don't make wire harnesses for air planes or passenger trains). More info please.

Propensity of Immersion Tin surface finish fo whiskers

Electronics Forum | Sat Dec 10 18:17:19 EST 2005 | Sergei

http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9595&#Message38364


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