Electronics Forum | Tue Oct 22 15:32:09 EDT 2002 | ruppertg125
We are a military contractor and need to build to IPC610 class3. We are receiving many parts with palladium leads and currently use a No-clean solder paste. We have evaluated OA pastes with very little improvements. Without a touch up of all leads th
Electronics Forum | Tue Sep 09 20:32:10 EDT 2003 | davef
The maximum ratio of gold weight to solder alloy weight can be calculated, to help prevent a problem from excessive gold-tin intermetallic compound (i.e., AuSn4). For the equation and its derivation, please refer to "The Use of Capillary Action Measu
Electronics Forum | Tue Sep 09 20:23:23 EDT 2003 | Pfb
We are using gold plated leads on SMT devices. Gold embrittlement is supposed to be a problem at concentrations above 4%. Has anyone done any work to qualify this?
Electronics Forum | Wed Nov 12 09:32:30 EST 2008 | markhoch
Are there better options? Dude, EVERYTHING else is a better option. Gluing aluminum foil down to the bare copper would be a better option. ENIG (Electroless Nickel Immersion Gold), Immersion Silver, Immersion Tin, and OSP all provide flatter surfac
Electronics Forum | Mon Jun 12 07:42:56 EDT 2006 | brian.perry@suntroncorp.com
We are placing a gold plated device (LCC) to a NiAu PCB using a SnPb No-clean solder. We're noticing quite a bit of difficulty with reliable joints (intermittent connectivity) and if we have to rework a particular device, adjacent devices of this sa
Electronics Forum | Fri May 31 08:51:09 EDT 2002 | zanolli
Hello Dave, As related to connector mating interface, fretting corrosion is the oxidation of the contact points, causing high resistance across the interface. Fretting corrosion is caused my micromotions in the interface exposing the metalized conta
Electronics Forum | Mon May 12 23:28:33 EDT 2003 | dehlers
To the best of my knowledge and experience the 2 % Ag component is not for embrittlement but rather to reduce gold scavenging caused by the propensity for tin to react with the gold. I have seen eutectic tin/lead actually disolve gold wire after a f
Electronics Forum | Fri May 03 16:06:44 EDT 2013 | hegemon
To be short, no change in profile is going to get you through this. As I recall the point of hard gold is to retard the wetting process, so no surprise here. For example a connector might have hard gold plating at the mating surface, but not at t
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl
Electronics Forum | Mon May 20 15:43:01 EDT 2013 | ngotranbestek
Hi I meet problem by PCB with diameter 300cm and thick 6mm i used tin-lead with profile normal, soak time 60-90 sec, Temp peak is 220 degree C, But solder see not good, not shiny. Any body recomend help me to fix this problem for Hard gold playing.
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