Electronics Forum | Mon Mar 20 09:24:38 EST 2000 | John Sipper
1. Spec references for max allowable untinned gold near glass seal and case body? 2. Low cost mechanical dip system to facilitate tinning of DIP parts. (Low volume; currently using hand solder iron techniques to allow for max coverage without bridg
Electronics Forum | Tue Mar 21 20:25:30 EST 2000 | Dave F
John: What�s the matter? Free gold � good thing for you, bad thing for your supplier. :^) Pre-tinning of gold plated leads is important to: � Prevent gold embrittlement of the solder joint � Determine if the leads are solderable prior to assembly (
Electronics Forum | Tue Dec 10 20:42:43 EST 2002 | davef
Vijay, Sounds like you're not spending enough time at liquidous plus 20*C. And you need to stay there for 5 to 10 seconds. I know, I know. We have used bucketsful of WS609 over the years. See, as you say, the melting point of your solder alloy
Electronics Forum | Tue Dec 10 05:03:58 EST 2002 | praveen
We are having solder fillet finish issue. The solder looks like rough solder on the connector leads .The plating of the leads is Nickel (99.9% purity) and the PCB plating is imersion gold. I have tried fine tuning my reflow profiles an have used N2 i
Electronics Forum | Fri May 31 08:51:09 EDT 2002 | zanolli
Hello Dave, As related to connector mating interface, fretting corrosion is the oxidation of the contact points, causing high resistance across the interface. Fretting corrosion is caused my micromotions in the interface exposing the metalized conta
Electronics Forum | Mon May 12 23:28:33 EDT 2003 | dehlers
To the best of my knowledge and experience the 2 % Ag component is not for embrittlement but rather to reduce gold scavenging caused by the propensity for tin to react with the gold. I have seen eutectic tin/lead actually disolve gold wire after a f
Electronics Forum | Wed Apr 06 08:27:12 EDT 2011 | kaschliman
Our two component suppliers use 99.5Sn/0.5Cu and 97Sn/3Ag solder (respectively) for tinning their leads. We use 98.9Sn/.66Cu/.33Ag solder in our wave solder machine. Is there any significant advantage to either tinning process regarding solderabili
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl
Electronics Forum | Fri May 28 16:30:39 EDT 1999 | JohnW
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Fri May 03 16:06:44 EDT 2013 | hegemon
To be short, no change in profile is going to get you through this. As I recall the point of hard gold is to retard the wetting process, so no surprise here. For example a connector might have hard gold plating at the mating surface, but not at t
