Electronics Forum | Thu Jun 13 02:20:43 EDT 2013 | mun4o
put the silk screen mask between pads.Add drain pads after TO220.
Electronics Forum | Mon Mar 24 10:02:44 EST 2003 | ksfacinelli
I have a board that has a few TO220 packages with the 5 lead style. The problem I am encountering is forming the the leads. The TO220 package needs a 90 degree bend with pins 2 and 4 staggered. I am "not" doing thousands but would like to find a co
Electronics Forum | Mon Mar 24 17:26:39 EST 2003 | pjc
try http://www.electro-prep.com
Electronics Forum | Mon Mar 24 19:08:51 EST 2003 | rdr
You could always make your own manual bender with shim stock etc...
Electronics Forum | Fri Jun 07 14:43:55 EDT 2013 | davef
Run the board at 90* from the direction that you currently run it through the wave BR, davef
Electronics Forum | Wed Jun 12 17:05:41 EDT 2013 | danselness
DeanM - thank you for your response. I will work on uploading a picture of the bridges. We are focusing our efforts on nine boards that use the TO-220 package. I will also pass along your idea of Oval Pads to our Manufacturing and Design Engineers
Electronics Forum | Fri Jun 07 10:28:23 EDT 2013 | danselness
We use a Wave Solder Plated Through Hole (PTH) assembly process to install a TO-220 Chip Package in the PCB board that we manufacture and have experienced lower yields on a number of boards with this component due to Bridges. The bridges on the TO-22
Electronics Forum | Mon Mar 24 11:09:43 EST 2003 | rdr
Excelta has some Pliers that may do this. I know that they have one for a 3-lead offset. You may try this number for more info. Ktec 18004685832 www.ktec-sys.com
Electronics Forum | Mon Mar 24 12:15:24 EST 2003 | zaxx007
Hi Kevin, Hepco makes a small unit called a Hepco 3000-2, with the right die set this should be no problem. The unit should retail for around $600.00USD, have a good day. Sincerely, Zack Schmad factory-automation@cox.net
Electronics Forum | Tue Mar 25 10:58:46 EST 2003 | davef
The best off-the-shelf option is: Go back to your customer and have them relay-out the board. This will: * Reduce labor costs. * Improve reliability by lowering the chance of package cracking caused by less than optimal lead forming.
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