Electronics Forum | Fri Aug 01 02:10:26 EDT 2008 | fowlerchang
Pad design is not only the size of pad but also the distance between two pad. N2 will increase tombstone as we tested. 10 zones reflow oven and slow temperature ramp will reduce this defect. MustII is the equipment which is used to test the solderabi
Electronics Forum | Sun May 04 22:10:20 EDT 2003 | Thomas
Did u ever try a anti-tombstone solder paste to try to eliminate this problem ??
Electronics Forum | Wed May 07 09:24:33 EDT 2003 | davef
Kris The majority of our tombstoning in very small passive SMT is caused by imperfections in end-cap solderability protection plating.
Electronics Forum | Sat May 03 00:58:51 EDT 2003 | ken
Did you check if the height of solder mask between two pads is higher than pads?
Electronics Forum | Tue May 06 06:31:21 EDT 2003 | yukim
The stencil thickness was about 7 mils and was changed to 6 mils.
Electronics Forum | Tue May 06 10:00:06 EDT 2003 | k_h
Got it, thanks, I've always used english mils. Have you solved the problem yet yukim?
Electronics Forum | Fri May 30 11:24:45 EDT 2003 | dsuraski
We also use microns to describe solder paste powder particle sizes.
Electronics Forum | Fri Apr 25 08:48:25 EDT 2003 | davef
If what you say is accurate, two thing come to mind: * Pads on the board are incorrect for the tombstoning components. * Profile is different on the individual pads of tombstoning components. We have heard of, but never seen, components [tants] that
Electronics Forum | Fri May 30 11:23:10 EDT 2003 | dsuraski
AIM has an article that includes anti-tombstoning solder paste information. It's called "Reducing The Tombstoning of Small Discrete Components" and is located at http://www.aimsolder.com/technical_articles.cfm#14 Or I can send a copy to anyone inte
Electronics Forum | Thu May 20 19:29:18 EDT 2004 | Neil D. M.
Hi David, Can you send me a copy of this article "Reducing The Tombstoning of Small Discrete Components". Thanks a lot.
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