Electronics Forum | Thu Sep 07 10:03:30 EDT 2000 | KS Wong
Hello, I am looking for input on the 7 zone convectional reflow oven on the temperature profiling. I having a problem with the flux/solder spattering on the Au cotact fingers. I have ran some experiment with the soak time and reflow time. Anyway,
Electronics Forum | Thu Sep 07 11:02:29 EDT 2000 | Travis Slaughter
Maybe its not splatter, in my experience a sloppy operator can get paste on contacts and just one sphere can rune them and can look like splatter.
Electronics Forum | Fri Sep 08 00:24:35 EDT 2000 | Jim Arnold
Sudden flux boil will cause splatter. More thorough drying or a slower intial ramp to allow drying to occur before a boil or "splatter" temperature is reached may aid your problem.
Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB
As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p
Electronics Forum | Fri Dec 16 11:04:23 EST 2005 | chunks
Over all time will be dictated by your conveyor speed. Your conveyor speed will be dictated by your products time above liquidous. Time above liquidous is dictated by the manufacturers specification. Time and temp before reflow will have to be ach
Electronics Forum | Thu Jun 11 05:22:37 EDT 2009 | phanviet
Dear all, Plz help me. We are running main board for LCD monitor. Some chip capacitor near QFP have tombstone. We try to adjust soak time for Reflow Oven, Adjust XY coordinate, Adjust solder paste amount...But problem still there. Thank for your supp
Electronics Forum | Mon Jun 18 13:29:34 EDT 2001 | nifhail
What is the recommanded profile for board which consist of 0402 & 0201 comps. to reduce the effect of tomb-stone. Slow ramp rate ? how slow is considered as slow. Soak time 60 or 120 C,at which end should I stick to? what is the best time before reac
Electronics Forum | Thu Jul 07 17:08:28 EDT 2005 | Inds
how fast are you ramping your profile..and how long are you soaking it.. are you giving enough time for the flux to get activated...
Electronics Forum | Thu Sep 10 19:26:24 EDT 2020 | emeto
Are parts always following the same side/direction of tombstone? 1. Run 180 and observe if tombstone moves or remains the same 2. Too much paste under the part - reduce aperture and move it out to the lead. 3. Soak profile for even heat distribution
Electronics Forum | Thu Apr 13 07:30:09 EDT 2000 | Christopher Lampron
I agree with Nick. You should check with the manufacturer to determine what type of plating is used on the components and see if the manufacturer has any recomendations on materials that may help. If no exotic materials are used, the culprit is most
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