Electronics Forum | Fri Aug 01 02:10:26 EDT 2008 | fowlerchang
Pad design is not only the size of pad but also the distance between two pad. N2 will increase tombstone as we tested. 10 zones reflow oven and slow temperature ramp will reduce this defect. MustII is the equipment which is used to test the solderabi
Electronics Forum | Tue Apr 09 05:10:39 EDT 2002 | sanchai
Dear sir, Do you have experiment about the temperature cycling and vibration test for reliability testing of surface mount solder attachment. If yes, please give me the soft file sample of parameter setting and testing report.. Thank you very mu
Electronics Forum | Tue Apr 09 08:27:55 EDT 2002 | davef
Read SM-785 - "Guidelines For Accelerated Reliability Testing Of SM Solder Attachments"
Electronics Forum | Wed Sep 29 02:16:37 EDT 2004 | FengAng
Hi all, Our department need to setup a reliability lab. And some equipments are need to purchase. At the first stage, thermal cycling test are going to be imported. If anyone of you have this kind of experience, please don't hesitate to SHARE me h
Electronics Forum | Fri Apr 24 20:33:06 EDT 1998 | D.Lange
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
Electronics Forum | Fri Sep 24 11:08:13 EDT 2004 | davef
We're not sure what you mean by temperature sensitive components. From an assembly process stand-point, every component we use is temperature sensitive to one level or another. More specifically, some of our products use polyphenylene sulfide (PPS)
Electronics Forum | Mon Nov 27 17:44:10 EST 2000 | Dave F
Gawd. Sure FR-4 will meet those conditions. Tg [check the fine SMTnet Archives for discussion on Tg] of FR-4 is 130�F or so. Consider: * Is the delT between Tg and the upper operating [or storage] temperature acceptable for your application? * D
Electronics Forum | Wed Jan 07 17:34:52 EST 2015 | duchoang
Customer puts our board to thermal test. Test cycle is -55c to 85c, repeat cycle in 15-20min. After 600 cycles, lot of TSOP joints are cracked, leads lifted. There are reasons such as thin PCB, mechanical impacts, warped PCB... My question is, how lo
Electronics Forum | Tue Nov 15 12:21:20 EST 2005 | arclightzero
Well, I can't speak for them falling off later on, as that's not when I see them, and they are passing their wire pull tests after bonding. What I am seeing is electrical opens during testing, and these opens coincide with the Au/Al bonded points. Th
Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
