Electronics Forum | Wed Apr 12 10:08:15 EDT 2000 | Chris May
Have you checked the pad geometry, shape / size etc ?? Regards, Chris.
Electronics Forum | Fri Mar 06 16:17:38 EST 2009 | aj
whats your board finish?
Electronics Forum | Wed Apr 12 11:00:26 EDT 2000 | NickMata
Aside from all of what you've done I would also suggest you take a look at component specs. Some vendors recommend a certain paste composition, for example a 2% silver content. I have found out thru experience that when using these components my to
Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t
Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro
Electronics Forum | Thu Apr 13 18:41:20 EDT 2000 | Michael Parker
I too have followed all of the useful suggestions provided herein. I still found some tombstoning which was specific to a manufacturers lot. I changed the reel to another brand and the problem went away. I suspect contamination or oxidation on the co
Electronics Forum | Tue Jul 05 13:54:35 EDT 2005 | Sandeep
We are facing lot of problems with tombstoning in 0201 components. Ironically tomstoning in these components is not occuring while reflow but it is happening when we subject them to thermal cycling test. We have been investigating the cause and thoug
Electronics Forum | Thu Mar 12 06:37:48 EDT 2009 | gregoryyork
I agree you are too cold for the profile get it up to 230C and possibly allow it to dwell a little longer in preheat as opposed to pushing up the reflow zone only. Sn90/Pb10 melts at 220C so 2C hotter than your profile so you are reliant on it alloyi
Electronics Forum | Tue Jul 05 15:21:46 EDT 2005 | russ
So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joints)? Must be quite the test! Tell us what pad sizing and spacing you are currently using.
Electronics Forum | Thu Apr 13 07:30:09 EDT 2000 | Christopher Lampron
I agree with Nick. You should check with the manufacturer to determine what type of plating is used on the components and see if the manufacturer has any recomendations on materials that may help. If no exotic materials are used, the culprit is most
Electronics Forum | Mon Apr 17 21:09:38 EDT 2000 | Bene
Do you know the wetting speed of the solder paste you are using? Ask your vendor for this measurement. I have observed this issue on several products using pastes with wetting speeds faster than 1 second. As stated previously, smaller packages are m
