Electronics Forum | Tue Jul 01 15:54:54 EDT 2008 | short_timer
I believe you hit the nail on the head. I just needed to hear it from another person. Glue is a good option. I'll give that a try.
Electronics Forum | Tue Jul 01 22:26:05 EDT 2008 | davef
Why do you want to increase the strength of the solder connection? Our experience shows that a proper solder connection has more strength than the strength of the pad to the laminate.
Electronics Forum | Wed Jul 02 08:06:10 EDT 2008 | ck_the_flip
Yes, your strength of the joint is in the intermetallic, and not additional solder. Solder ain't like duct tape, where the more you put, the better it'll hold.
Electronics Forum | Tue Jul 01 12:21:16 EDT 2008 | short_timer
Let�s say I want to increase the shear strength of a solder joint. Does a lot of solder around a joint create more strength? Why not just absolutely bury the component lead in solder. My initial thought is that it doesn�t increase strength, but I don
Electronics Forum | Tue Jul 01 13:45:12 EDT 2008 | realchunks
The actual solder joint occurs BETWEEN the part and the pad. Adding more solder on top will add strength slightly, just by being in the way when you pull on it sideways. A weak joint with a weeks worth of solder on it will still be weak. Solder is
Electronics Forum | Thu Mar 28 11:37:08 EST 2002 | Bob
I have been looking at cross sectioned joints. In some instances there are areas where there are large concentrations of silver. Could anyone quantify what is too much and also explain how the intermetallics are formed. Thanks.
Electronics Forum | Wed Jul 10 22:13:45 EDT 2019 | SMTA-Ray
I don't recall if the heater wattage is the same or not for the different pots. If the wattage is different then the PID algorithm is also different. this anticipated when & by how much the heater will overshoot its setpoint and turns the heater off
Electronics Forum | Mon Apr 01 07:41:40 EST 2002 | davef
Hey Bob, Boy, you are lucky to have a laboratory, and now colorful pix!!! The only silver IMC that you will see are: * Ag6Sn, much less likely at 'normal' soldering temperatures * Ag3Sn, much more likely Allowable silver concentration: * Below 2%
Electronics Forum | Fri Jul 18 15:25:19 EDT 2014 | davef
The presence of agitation at an air / solution interface and a foaming agent causes foaming. Most water soluble fluxes contain surficants. Surficants are foaming agents. First, it's likely this foaming is caused by poor control of the temperature of
Electronics Forum | Thu Mar 28 14:04:16 EST 2002 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
