Electronics Forum: too much solder on bga (Page 1 of 21)

Solder reflow temperatures too high

Electronics Forum | Sun Jan 14 12:42:35 EST 2007 | SMTRework

I think the main cause of this condition is #3 because both #1 and #2 never change from board to board, these are identical boards with identical BGA revisions. These BGA's (as stated before) are about 3 years old.. I don't believe they are lead free

Solder reflow temperatures too high

Electronics Forum | Thu Jan 11 22:01:09 EST 2007 | davef

Joe: I know this is not the correct forum to post chip "reworking" questions. Reply: Rework questions are as appropriate as the next topic here on SMTnet J: BGA will not reflow at any normal temperature level. I believe these chips may have been gen

How much it costs to building a PCB factory?

Electronics Forum | Sun Feb 05 17:44:47 EST 2017 | spoiltforchoice

Printer->Paste Inspection(which might be a feature of the printer)->High speed placer (for all the little parts)->Accurate Placer(for your BGA Processor,RAM,eMMC and big things that don't fit in the high speed)->Reflow oven->AOI->PCB stacker All of t

Re: solder balls on high temp.solder

Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph

I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste

Laser marking on white solder mask.

Electronics Forum | Thu Feb 04 12:01:07 EST 2016 | g2garyg2

Hi Luis A white mask typically helps in the marking process since you are not reliant upon the PCB layers to create the contrast. Laser marking is really an etching process, so if your laser is set properly (power and focus) the goal with mask is to

CERSOT-23 solder on top of package

Electronics Forum | Tue Jul 25 14:30:04 EDT 2017 | emeto

Looks like you have a great wetting of your paste :). Once body has been in contact with molten solder, the package could suffer damages on the body(outside and inside) and on the circuitry inside. It is considered a defect. I have seen that before a

SPC for Wave solder (defects on PCB's)

Electronics Forum | Wed Feb 08 12:23:12 EST 2006 | slthomas

Just to nitpick a little, collecting defect data and reacting to it really isn't an SPC function. Cal's recommendations (determine critical processes, assess process capability and acceptable limits) are spot on and are pretty much the definition of

Re: Poor solder joints on QFP 100's

Electronics Forum | Mon Dec 13 19:34:09 EST 1999 | Steve Thomas

Thanks, gentlemen. All points well taken, and some hit pretty close to home. Our pick-and-place programmer assures me that coplanarity isn't the issue because the machine won't (or can't) place parts beyond an acceptable criteria. It's an Amistar

Re: Poor solder joints on QFP 100's

Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.

Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to

grey appearance on solder joints after batch cleaning

Electronics Forum | Tue Feb 11 14:05:11 EST 2014 | dontfeedphils

I can't speak too much as to why your joints are appearing dull, even with the booster. I can recommend a new chemistry that Kyzen has out that I've been running for about a year now. Price is about the same, it can be run at low(er) concentrations

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