Electronics Forum: top (Page 169 of 312)

How to install FBGA ICs on both sides of Flex boards with no stiffeners ?

Electronics Forum | Thu Aug 09 16:24:27 EDT 2018 | ks0707

Hi Thomas, Thank you for your posting and I agree with you that Printing is the most difficult one. BTW, after you ran the one side (let's say Bottom side), my engineer worries about the distortion of flex board because of the thickness. In that ca

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Fri Sep 07 04:19:59 EDT 2018 | spoiltforchoice

You have lost me, its a stencil, you can change the aperture size, you can change the thickness and you can change the walls of the aperture. And all of those things will be in the papers anyone can find with a google. I have no clue what safe air g

Supported holes, Solder, Vertical Fills, Hidden under connector body

Electronics Forum | Fri Oct 12 12:12:13 EDT 2018 | davidsmullins

We have some fairly standard 0.1" pitch, two row, shrouded, through hole headers soldered onto a thick backplane. There are tiny inspection holes along the bottom edge of the plastic body that allow an inspector to observe the top of the through hole

INSITE B BENCH TOP AOI

Electronics Forum | Fri Dec 14 08:55:40 EST 2018 | davef

Some breadcrumbs for you ... Orbotech: In 2009, Orbotech's Assembly Automated Optical Inspection (AOI) division, which had been started in 1997 by the acquisition of Schuh GmbH, was spun off into a separate company, ORPRO Vision GmbH, which was then

GCpowerplace Inspection for Momentum Printer Bottom layer Issue

Electronics Forum | Tue Jan 15 14:11:12 EST 2019 | griinder

I also use these when available. The problem still persists for Bottom Paste/Parts layer. The non-symmetric(x axis) footprints in the Btm part layer, display correctly in the software, But then display incorrectly when imported into the Printer. The

Merging BoM and XY Data

Electronics Forum | Fri Feb 22 13:55:27 EST 2019 | bruce_mackean

Is there a need for a simple application to merge a bill of material with the xy placement data into a single (or top/bottom) files for machine programming? ie. add a part number column to the xy data, including "N/A" for parts not found in the BoM?

Looking for trays to lay boards on in reflow oven

Electronics Forum | Tue Jun 11 12:15:27 EDT 2019 | sumote

Consider an adjustable (or fixed) process carrier then. It could offset the board so that your component is better centered. I have used Pentagon EMS for such carriers in the past. They are pricey, but last forever. We were a contract house, so the c

SMD module moving during reflow

Electronics Forum | Wed Jun 26 04:00:30 EDT 2019 | SMTA-David

Thanks, I'll take a look. Something else I found was the Z height for the module was set to 1.7mm but I am picking up the part on the PCB surface which is only 1.0mm from PCB being loaded, therefore the part must have been let got 0.7mm above PCB an

Micro-Dispensing using a Essemtec Paraqudu and Vermes MDV-3200

Electronics Forum | Tue Jul 23 11:06:00 EDT 2019 | majelacquinn

Currently trying to get away from using stencil printing. Looking for information on Micro-Dispensing and dot size using a Vermes MDV-3200A micro jet dispenser. I am using a Indium led free solder that has size 6 balls. With a 100 micron dispense hea

Quad QSV TEP Controller Issue

Electronics Forum | Thu Jul 25 14:18:34 EDT 2019 | babe7362000

It's been awhile but I was wondering if anyone knows how to read the LED's on the Tep board to what they mean. Top 4 Red 1. blinking red 2. lit red 3. off 4. lit red 5. lit red 1. blinking green 2. not lit 3. lit green 4. off 5. off On the Gui


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