Electronics Forum | Thu Nov 29 13:05:46 EST 2007 | stepheniii
I really hate to ask but must. Are the components that are falling off, the components that don't have glue? Seriously not all the parts on the bottom are glued on? How do they stay on during the wave? The normal way is to run the top SMT as normal
Electronics Forum | Fri Oct 21 14:13:08 EDT 2005 | mafc65
1.- Clean bottom and top stencil with a cloth/alcohol at same time.Pay special attention to fine pitch locations. 2.- Clean again bottom stencil side .To prevent any residual of solder 3.- Blow air with a air gun under the stencil to remove the solde
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Wed Mar 05 08:05:46 EST 2003 | Yngwie
Thanx Marc..this is good input.
Electronics Forum | Fri Mar 07 03:37:26 EST 2003 | emeto
Hi Ygwie, My experience shows there is not unique answer.Actually it depends on design,printing reflow or wave.It might be top side with lesser cmps.Top side might have fine pitch or BGA or CSP,LLGA ....,so you have better planarity when the PCB is b
Electronics Forum | Tue Mar 04 00:55:12 EST 2003 | nifhail
In the double sided SMT process assembly, normally the bottom side will be processed first, due to it's lesser density as well as it's lesser heavy components. Apart from worrying about the component falling down, what are the potential problems that
Electronics Forum | Tue Mar 04 13:32:17 EST 2003 | MA/NY DDave
Hi Unless I am missing something, None if done right. YiEng, MA/NY DDave
Electronics Forum | Tue Mar 04 18:38:12 EST 2003 | ruggi
Most of what we do (across 800+ varieties) is bottom side first. In general, there really aren't any problems as long as our Customers follow the .25g/cm wetted lead perimeter spec for weight (which many don't), and don't mount tall components on th
Electronics Forum | Fri Apr 02 05:06:49 EDT 2010 | atchoum
Hi, I'm looking for an adhesive which can be stencil printed, in order to assembled PET (top layer) with Glass (bottom layer) for resistive touch panel application. The adhesive should be deposited at the border of bottom &/or top layer. Do you know
Electronics Forum | Fri Nov 14 12:41:30 EST 2014 | duoman
I also operate a 3/45. In order to flux from the top, you would need to have another system on top similar to what you already have on the bottom. There just isn't room for all of the required equipment. Who did you contact at ERSA? I have always had
