Electronics Forum: topside (Page 1 of 35)

Topside Heat on Board

Electronics Forum | Mon May 29 10:30:19 EDT 2006 | Marc

All, What method does everyone use for measuring the heat on the topside of the board in a Wave- we are currently using temp stickers. If the Flux is activated at between 110-120 degrees Celcius does this mean that the topside should read around 90

BGA,s Storage

Electronics Forum | Mon Nov 12 16:10:46 EST 2001 | davef

There is no doubt that we reflowed topside BGA on our wave solder machine. We run our wave pot at 450�F and that�s plenty hot enough to reflow solder on topside SMT components. When the solder balls on the BGA melt, the package is over 200�C, trust

Topside Heat on Board

Electronics Forum | Tue May 30 09:52:46 EDT 2006 | patrickbruneel

Temp stickers work fine but a temp profiler gives you more useful data. The topside temp depends on the type of flux you use Look at the flux spec sheet or ask your flux supplier. Patrick

Leaded and Lead-Free Wave Parameters

Electronics Forum | Thu May 22 14:44:10 EDT 2008 | samir

Does your top-side preheat NEED to be that high, and so high that you are exceeding the flux manufacturers' spec? If so, what is the reason? Top-side wetting? Are you measuring this temperature at the substrate or solder joint?

Hand Soldering SMT Cap ?

Electronics Forum | Wed Sep 29 15:28:45 EDT 2010 | mikesewell

Are the TH parts on the topside hand soldered then? Why not print-place-reflow the topside SMT cap first then run the bottomside through the same process? It is normal, although not preferred to solder SMT parts on by hand. A 1206 should not be di

Re: Cure/Reflow Profile

Electronics Forum | Tue Feb 22 14:31:20 EST 2000 | JAX

If you are not placing any parts that need special attention ( BGA, CCGA, etc... ) on topside then it should be fairly easy to create a profile that will work for you. If you are wanting to use the profile you currently have for topside I am not sur

Re: Cure/Reflow Profile

Electronics Forum | Tue Feb 22 14:31:20 EST 2000 | JAX

If you are not placing any parts that need special attention ( BGA, CCGA, etc... ) on topside then it should be fairly easy to create a profile that will work for you. If you are wanting to use the profile you currently have for topside I am not sur

BGA Issue

Electronics Forum | Fri Jan 30 16:07:45 EST 1998 | Srik Maganti

We are in process of building a product which is a double sided board ( SMT ) and PTH ( topside ). This particular product has a BGA on the topside of the board, which has a kind of plated top on the die. I have heard some companies have had a probl

Wave soldering profiling

Electronics Forum | Mon Apr 12 10:39:48 EDT 2004 | Ron Herbert

Correct preheating of the assembly is critical. Check with your flux manufacturer regarding the recommended topside pcb temperature as it enters the first wave. It is important that this temperature be achieved without burning the flux on the bottom

Wave Soldering Upflow

Electronics Forum | Tue Aug 05 12:05:15 EDT 2003 | mleber

Through hole question - what methods can be used to obtain upflow on multi layer pwbs with huge ground planes. We are using a water soluble flux with a max temp of 220 topside. I am pushing the limits of the flux and hitting 250 topside in an attempt

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