Electronics Forum | Mon Jan 09 18:51:05 EST 2006 | grantp
Hi, I have used both MYDATA TP9, MY9 and more recently MY12. MYDATA machines are just not accurate, and we did everything possible, and every kind of upgrade they had. We ended up putting in Fuji XP based machines, and the differences are very notic
Electronics Forum | Wed Jul 26 18:23:47 EDT 2000 | Gary
I have been following forum discussions here and eslewhere, attended technical sessions at APEX and have been experimenting with the paste-in-hole process on some of our new product. I have run into one problem I have never seen mentioned, that is a
Electronics Forum | Sun May 23 21:33:42 EDT 2010 | ashley
"The part is picked up and head goes to it's xy location" Hello mickd, I believe VP had passed but machine is confused how to compensate & place. OS error normally associate with a faulty VME card. Please check the following :- VM1152 VM1730 VM193
Electronics Forum | Wed Sep 23 08:19:52 EDT 2009 | rgduval
Check to see if there's a loose cable, or something, that's randomly setting off the light curtain. We occasionally have that problem with some of our flex or 12/16 mags in our TP9, where the tape take up clip is loose (nothing in that feeder) and i
Electronics Forum | Tue Sep 18 15:35:23 EDT 2001 | jschake
A laser cut stainless steel stencil was used exclusively for the evaluation of the complete 0201 assembly process, which addressed printing, placement, and reflow. However, I have also conducted off-line 0201 print tests using a nickel electroformed
Electronics Forum | Thu Mar 03 09:04:26 EST 2005 | russ
Been following this thread and have a question, Why do "touch-up" people follow different criteria than "Q.C." people. It sounds like the root of the problem is not addressed but bandaids are being put into place. We have no "Q.C." department and
Electronics Forum | Sat Jun 06 09:53:59 EDT 1998 | Earl Moon
GEOMETRIC DIMENSIONING AND TOLERANCING (GDT) Using and applying GDT to printed circuitry and assemblies is very much like applying it to any other design for manufacturing (DFM) or design for assembly (DFA) requirement using concurrent engineering (C
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Mon Feb 19 11:36:39 EST 2001 | billschreiber
Hello Mark, I wish it were that simple so I could direct you to a particular manufacturer and stencil cleaner model. Unfortunately, there are several issues complicating the process of cleaning all these applications in one machine. First and fore
Electronics Forum | Sun Mar 04 17:22:08 EST 2007 | ethercom
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