Electronics Forum: traces (Page 1 of 80)

Resistance of traces

Electronics Forum | Tue Sep 14 13:36:11 EDT 1999 | Jeff Armato

I am looking to find a formula to calculate the resistance of circuit traces based on width

Re: Resistance of traces

Electronics Forum | Tue Sep 14 13:49:14 EDT 1999 | Earl Moon

| I am looking to find a formula to calculate the resistance of circuit traces based on width | The old MIL-STD-275 became IPC-STD-275 became IPC-2221/2222. Anyway, they had/have simple graphic representations converting AWG standards into equivalen

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Reflow soldering problems and traces under component

Electronics Forum | Tue Jul 19 11:52:24 EDT 2016 | oleksz

Thank you Pavel. Aleksander

Routing through sections with copper traces

Electronics Forum | Mon Dec 05 17:46:10 EST 2022 | SMTA-64387381

Does anyone have experience with routing through areas of PCBs with Cu traces running through them. Trying concept to design in functional "wing" portions to our main board in an effort to get 2 in 1 functional boards - a fully functional main PCB

Thermal Relief BGA pad design traces

Electronics Forum | Mon Jun 02 16:33:35 EDT 2008 | operator

Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of

Reflow soldering problems and traces under component

Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev

Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering

Thermal Relief BGA footprint design - traces - reflow

Electronics Forum | Tue Jun 03 12:49:29 EDT 2008 | operator

If only my company would pay for a membership to IPC......

Thermal Relief BGA footprint design - traces - reflow

Electronics Forum | Wed Jun 04 00:13:18 EDT 2008 | operator

Very informative article. Thanks Dave.

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