Electronics Forum: traps (Page 3 of 27)

how to prenvent flux risidue in the blind vias.

Electronics Forum | Thu Feb 15 12:32:14 EST 2007 | Eric D

one of my customer areworried about the flux risidue in the blind vias, or if the plug the vias and there is air trapped the plug will blow during our process. Appreciate for your response

how to prenvent flux risidue in the blind vias.

Electronics Forum | Thu Feb 15 13:49:10 EST 2007 | russ

only plug one side, you can definitely blow out during reflow process with a sealed via/ it is impossible for flux to be trapped in a blind via. Russ

Who's heard about

Electronics Forum | Wed Aug 01 12:23:21 EDT 2007 | stepheniii

Don't forget rework, post production eco's and other mods. Also if it's on a generic base, how do you spot slight misplacments? Board shops have some fallout, now the fallout with be with the assembly makers and with components trapped on the subst

PCB Baking after Wash

Electronics Forum | Wed Dec 03 07:30:57 EST 2008 | realchunks

Hi System Steve, What is a solvent cleaner over water wash? Solvent first and then rinse with water? And why do they feel the need to bake the boards? Do they think trapped moisture will cause board damage?

Solder Balls

Electronics Forum | Tue Mar 31 05:48:32 EDT 2009 | d0min0

depending on what is diameter of your balls ;) and smallest electrical distance on the boards (IC legs?? or other) solder balls trapped in ?? or not ?? base on that to see how dangerous your solderballs can be

Question of delamination in PCB

Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef

You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.

Solder void underneath the mosfet

Electronics Forum | Thu Mar 25 12:34:26 EDT 2010 | bgaguy

the voids will cause a long term relability problem as the part will not be correctly heatsinked. Change your stencil aperature to a "+" sign 15-20 mils wide in the center of the pad. ___________ : | : : | : :----|----: : | : :__

Batch cleaner

Electronics Forum | Tue Sep 07 12:57:00 EDT 2010 | jrr3434

Thanks for the info mike. How well do these batch cleaners work with densely populated through hole boards that were solder with no clean flux? Is there a problem with water getting trapped under large capacitors? I'm using kester 959t for flux on b

SOT-223 Flux trapped under part and lifting off pads

Electronics Forum | Wed Sep 29 09:29:47 EDT 2010 | swag

Take a few parts from the reel and look close at the parts to make sure the bottom surface of the leads is below the bottom surface of the body.

Blow hole on pad after reflow oven

Electronics Forum | Fri Jan 21 11:00:56 EST 2011 | xps

Hi, in my experience, the humidity is trapped in the solder paste. Otherwise you can also try to : adjust preheat profile, and /or increase paste viscosity, and /or increase paste metal content (they are the most common causes).


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