Electronics Forum | Mon Sep 26 15:14:56 EDT 2011 | nucleartoast
I agree with Shean that contamianted air is your problem. Either water or oil got into the supply line and is mixing with the flux. You should have both a water and oil trap at the inlet of the machine and not back at the compressor.
Electronics Forum | Thu Sep 13 18:00:35 EDT 2012 | mark25y2001
possible problem are loading orientation, solder flow cannot reach the pad portion due to trap of the body of the diode... or try to adjust turbulent but observe overflow... because turbulent are penetrate solder to pad and terminal of the diode. ho
Electronics Forum | Thu Feb 14 17:40:34 EST 2013 | jorge_quijano
PCB Supplier made an EDX anaysis, the found a chemical trapped in the holes, and some burnt burrs, according to what they say this stains are over the solder mask & silk, so they do not affect functionality.
Electronics Forum | Thu Jul 10 09:41:37 EDT 2014 | bobpan
Can anyone recommend a top notch filter to remove oil from the compressed air lines. The filter will be placed before the machine. We have traps that catch .01 micron oil in the airline but it is still getting through to the machine. Thanks, Bob
Electronics Forum | Thu Aug 24 02:10:52 EDT 2017 | fadzril
Hi! My company is considering to purchase reflow oven. Specifications : 10Zone Air Reflow, N2 Ready. What type of items should I consider? 1. Cooling Zone? 2. Length? 3. Power Ratings 4. Flux Trap Kindly advise. Thank you.
Electronics Forum | Fri Jun 07 11:08:34 EDT 2019 | gregoryyork
OK good if you get really close to the two small solder balls trapped in that greasy waxy residue and carefully turn the balls over you should see that they are flat on the side stuck to the solder resist.
Electronics Forum | Sat Jul 11 03:01:29 EDT 2020 | researchmfg
The bubble inside BGA ball locate at via in pad and apply the resin plug hole.You shall check the cooper plating quality on PCB pad. If there is thin plating or broken on the pad then air will come from the resin plugged via and be trapped inside the
Electronics Forum | Thu May 04 13:20:55 EDT 2023 | tommy_magyar
We do the same as dontfeedphils, with the difference being that it goes through a drying program too after stencil wash program (3 mins @ 90 degrees air spray) to dry out the via holes and any trapped liquid from under the components.
Electronics Forum | Wed Apr 21 14:29:58 EDT 1999 | joe devaney
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Tue Aug 21 03:42:55 EDT 2001 | mugen
SMT community, My Fellows, 1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? 2) why is water-soluble (WS) not a hot choice? 3) All I know, *is in layman terms*, that BGA has tendency to trap water, should WS process be the c
.gif)
