Electronics Forum | Thu Nov 09 15:13:40 EST 2006 | RJ K.
Thanks Jerry. Did you buy your unit through Ersa or a used dealer/distributor?
Electronics Forum | Mon Jan 03 14:10:02 EST 2005 | scotceltic
Can anyone tell me what type of material that the standard IPC SMT trays are made of ?? I am trying to mill some out however I need to order the correct ESD safe material ??
Electronics Forum | Mon Mar 30 09:52:56 EDT 2015 | rgduval
Seems like you've got it about right....though, it's a rather complex equation. Loaded labor cost is only a part of it, if you're trying to estimate down to the last cent. You have to account for energy utilization, space utilization in the factory
Electronics Forum | Mon May 03 16:36:08 EDT 2004 | Kris
Try getting a small contract manufacturer who will build the boards for you initialy that way you can learn untill you establish the process once you do that you can have a fair idea of what machines to buy ? where to buy ? or maybe if the volumes
Electronics Forum | Wed Jul 13 14:50:29 EDT 2005 | rameshn
Dear Sir, We are manufacturing Computer Motherboards & Networking products (which are having 2 to 3 BGA Chips onboard) in our plant. we are having 2 nos of HELLER 1800W model Reflow Ovens. this model reflow oven is having 9 heating zones at both top
Electronics Forum | Tue Mar 31 09:22:48 EDT 2015 | rgduval
I've always hated using machine specs....they're always best case scenarios, and nearly never capture actual through-put rates. Personally, I don't like using first-piece rates, either...unless you're looking for worst case scenarios. Usually, the
Electronics Forum | Mon Nov 01 06:19:45 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
Electronics Forum | Mon Nov 01 06:27:15 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
Electronics Forum | Mon Jun 06 06:31:44 EDT 2005 | mattkehoe
Try This. www.sipad.com mk
Electronics Forum | Sun Oct 31 23:58:54 EST 1999 | John A.
Do both sides of that board contain larger IC's and other large components or just one side?? If just one side contains large components, try running the side with the smaller components first, and then run the other side last. If that doesn't work
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