Electronics Forum | Mon May 05 18:48:23 EDT 2003 | Kris
Hi, It is expected that lead-free will have reduced tomstoning. As it has a higher surface tension and does not wet as well as the tinlead paste it exibit lower tombstoning. Addiotnaly commercialy available lead-free alloys may not be true eutectic
Electronics Forum | Thu Dec 19 14:00:24 EST 2019 | kylehunter
True, but with rosin it should protect the joints pretty well right?
Electronics Forum | Thu Mar 27 22:00:27 EST 2003 | davef
Enrique It's true that higher energy guns do a better job measuring "light" materials. [Actually, if that was true by itself, you'd expect the fabricator's readings to be higher than yours. But, HEY!!!] Regardless, there's alot more to getting an
Electronics Forum | Thu Apr 14 18:51:19 EDT 2005 | KEN
What side is the short occuring on. Topside or bottom (solder) side? 2. Pitch of hole pattern = ? 3. Your x-ray may not have the resolution or DSP capable of detecting this defect. How does your profile look? Is this a true short or the result
Electronics Forum | Thu Nov 01 12:13:10 EST 2001 | jonathan
I guess this clarifies the defect more then looks at the process, but I�ll just through it out there for the sake of learning something new. If anyone would comment on this please feel free�. There are many different varieties of dewetting defects.
Electronics Forum | Sat Feb 14 13:33:10 EST 1998 | ashok dhawan
| I am beginner in BGA assembly and am confused in selection of centering method on pick and place operation.. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you can use Mechanical c
Electronics Forum | Thu Apr 26 11:40:10 EDT 2007 | CL
Good Morning, We have a 3D solder paste inspection machine. We purchased it on a recommendation from a consultant. We are a CM high mix low volume. The President of my company has attended some seminars and meetings where it was conveyed to her that
Electronics Forum | Sat Sep 01 06:09:25 EDT 2001 | opor_a
Hi guy Please help advise me the impact of using Nitrogen to solder bridging defect. I heard somebody said that using nitrogen can effect the bridging problem by higher surface tension in case inaccurate printing . Is it true? Thanks.
Electronics Forum | Thu Jul 14 10:00:21 EDT 2005 | chunks
Any one using SPC to monitor their wave solder process? My point is collecting defects and using a scatter plot is useful but only after a problem occurs. SPC's true function is to warn of impending problems that are about to occur. Can SPC really
Electronics Forum | Fri May 29 02:05:34 EDT 2009 | nibirta
So true :) But I think we will have the final fight with the supplier when we will have troubles with the ENIG. We will assembly the product. From my experience, i never found a product with no black pad defects. It depends of the fabrication lots. T
