Electronics Forum | Sat Feb 26 09:22:19 EST 2000 | Dave F
Jason: Assuming you wantto reuse the TSOPs, two things come to mind: 1 Don't bend the leads. This can be caused by not melting the solder on all leads at the same time. 2 Don't break the body. This can be caused by moisure absorbed by the case ex
Electronics Forum | Sat Feb 26 09:22:19 EST 2000 | Dave F
Jason: Assuming you wantto reuse the TSOPs, two things come to mind: 1 Don't bend the leads. This can be caused by not melting the solder on all leads at the same time. 2 Don't break the body. This can be caused by moisure absorbed by the case ex
Electronics Forum | Fri Oct 29 02:07:48 EDT 1999 | Eom In Soub
hi. guys Have you out there ever seen the crack by means of humidity after reflow solering. We cannot analyze the cause of the tsop crack. The shape of crack seem to be hitted by sharp stuff. but there is no scar around crack . TSOP shaped long rec
Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc
Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos
Electronics Forum | Wed Jul 19 20:48:05 EDT 2000 | Dave F
Craig: Waving TSOP should be your last choice. You should resist will high levels of red faced, neck vein bulging seriousness. After you loose: * Philips pads are a good starting point. * Recognize you'll probably have to lay-out the pads on the b
Electronics Forum | Wed Jan 07 17:34:52 EST 2015 | duchoang
Customer puts our board to thermal test. Test cycle is -55c to 85c, repeat cycle in 15-20min. After 600 cycles, lot of TSOP joints are cracked, leads lifted. There are reasons such as thin PCB, mechanical impacts, warped PCB... My question is, how lo
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Fri Jan 08 19:47:55 EST 1999 | Kwang-Seong Choi
| | HI! I am a package engineer in Korea. I have some reasons | | to desolder excessive solder at the lead of TSOP and TSOJ | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | | Does
Electronics Forum | Fri Jan 08 02:27:00 EST 1999 | Kwang-Seong Choi
HI! I am a package engineer in Korea. I have some reasons to desolder excessive solder at the lead of TSOP and TSOJ after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. Does anyone know the
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