Electronics Forum | Sat Jan 05 04:13:23 EST 2019 | bane016
actually not...only with NPM W2 AND TT2...and with HDP dispenser...CM602 402 is an older generation than NPM but the principle is the same..the program is slightly different...im more than 10yrs in this job..
Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef
You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1
Electronics Forum | Tue May 16 13:53:19 EDT 2006 | patrickbruneel
Hi Rob, Don't feel sorry I like these discussions make us think more thorough. This is the supporting scientific paper they used in support of the exemption request. Effects of lead on tin whisker elimination By Wan Zhang and Felix Schwager. http:
Electronics Forum | Tue Aug 07 20:43:47 EDT 2001 | davef
First, we know that MIL types are wont to use charts like that. Give �em Weibull distribution tables and then they�ll be happy, happy. A good book is Nelson �Accelerated Testing: Statistical Models �� Wiley Second, we don�t use that very nice stu
Electronics Forum | Mon Jun 29 15:10:10 EDT 2020 | spoiltforchoice
I would specifically look at the FLX2011 models with a V for vision (they otherwise come with Cyberoptics laser alignment as standard, although that would also work if you are not inspecting BGA balls). They come with software that I think is called
Electronics Forum | Fri May 20 03:41:04 EDT 2016 | jpcwg
With power components coming in smaller and smaller surface mount packages it is very important to come up with a coherent approach to mitigating the thermal dissipation requirements of these components in a PCB design. While the development of an ex
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