Electronics Forum | Fri Mar 02 03:14:01 EST 2018 | reckless
The budget is tiny, I agree. It is more to get our feet wet. We are mostly afraid of adding more steps in the process thereby making it more difficult to implement. I want to avoid a wave soldering machine and also want to avoid making two passes
Electronics Forum | Fri Jun 04 21:27:16 EDT 2010 | deanm
We have a 4 zone Quad ZCR 531B reflow oven with top side heaters only and a mesh belt. Our boards are 2-6 layer, range in size from 2x2 to 7x15, 0402 to D2PAK. What are the limitations/drawbacks of having top side only heat, especially since about ha
Electronics Forum | Tue Jul 03 08:17:35 EDT 2012 | rway
Gold and Silver finishes are the best for sure. Unfortunately, they can't mix the finish in a single pass. It's a two step process, which raises your cost.
Electronics Forum | Fri Apr 04 17:43:52 EST 2003 | Kris
Hi, Did you use this paste before with out any problem or is it occuring for the first time ? If you wash only once a double sided board the side that passes through two reflow will have hardened flux which will may not be washed in your normal wa
Electronics Forum | Thu Aug 28 11:02:28 EDT 2008 | omid_juve
we have two similar pcb from two different pcb manufacturer one of them passed the wave soldering without any short circuit and residue and another one passed it with many residue . don`t you think that the type of solder mask from these two pcb manu
Electronics Forum | Fri Dec 16 08:16:41 EST 2005 | davef
Heat cycles deplete the pure tin layer. Each solder cycle reduces the tin thickness by ~0.1 micron (4 uin). So, if you start with a thin imm tin coating you'll have problems after multiple heat cycles. Steve Wentz says, "In almost every case I've
Electronics Forum | Sun Jul 26 07:52:35 EDT 2020 | sync40
Hello to everyone, Have you ever experienced soldermask bubbles inmediately after printed the soldermask itself? (for screen printing method of LPISM). I am not talking here about blistering or any outgassing defects after exposing to high temperatu
Electronics Forum | Mon Nov 11 21:44:06 EST 2019 | kylehunter
> Knead pressure, is normally at or slightly lower > (maybe 25%) than print pressure... Ahh makes sense. Couple other quick questions if you don't mind: 1) Currently do kneading after 15 mins of no activity, with 3 knead passes, is that n
Electronics Forum | Tue Dec 17 11:01:24 EST 2002 | Tim Marc
Hello all, One of our PCB manufacturers coated a through hole connecters vias with solder mask. The only IPC references that comes close to describing this problem is 2.9.2 Registration to holes, and subsequent specification 6.3.1 PTH � Vertical fil
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
