Electronics Forum | Thu Jan 09 10:58:30 EST 2003 | soupatech
Thanks for the input.... I ordered a 5 mil stencil AND used more tooling under the board. This gave me a much smaller deposit of solder. I wouldn't swear that was my problem but 96 boards later the problem is 99% gone. I believe there was just too mu
Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ
I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component
Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ
I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component
Electronics Forum | Thu Nov 11 19:07:39 EST 1999 | Gary Kemp
We are having a continuing problem with 0603 chip capacitors not centering themselves on the pads during the reflow process, causing an open condition at one end. Does anyone know what can be done to alleviate this? Thanks much. Gary
Electronics Forum | Mon Nov 01 10:16:42 EST 1999 | Mark Anderson
I am interested in getting some feedback on what different companies are doing to eliminate the solder beading issues on 0603, 0402 chip components using a no-clean process. We are currently incorporating a solder mask removal between the solder lan
Electronics Forum | Tue Jun 20 02:51:52 EDT 2000 | Leland Woodall
Gary, We've experienced the same problem in the past, and found that moving the stencil apertures closer together solved the dilemma. This was a much easier solution than having to redesign the PWB. Leland
Electronics Forum | Mon Sep 11 04:10:46 EDT 2000 | Jim Arnold
I spent 25 years operating my own hybrid shop working with surface mount components, soldering materials and procedures. Dealing all the while with it's associated surprises and problems such as yours. Now-a-days I get paid to investigate and attemp
Electronics Forum | Fri Aug 25 00:15:15 EDT 2000 | Wilson
Hi all, Does anybody meet large size of tape cavity in 0603 components? It is a serious problem in some vendors that their tape tolerance is very large. It lead to our fallout rate abnormal high. What is standard tape cavity size? Why the componen
Electronics Forum | Wed Dec 22 05:42:19 EST 1999 | Wolfgang Busko
Hi John, I�ve seen problems some sites have or had with bridging problems in the wavesolder process with 1206 and 0805. Adjusting the system and focussing on the flux parameters sometimes improved things. With some older systems it was hard to get s
Electronics Forum | Thu Jan 09 10:47:36 EST 2003 | Hussman
Depends on what you mean by shifting towards each other. Otherwise, 7 mil should be fine for 0603. I've used 6mil, 7mil and 8 mil without problems. Generally, stencil thickness won't have a bearing on "shifting" parts. Check placement. Make su
