Electronics Forum | Mon Sep 11 04:23:49 EDT 2000 | Wolfgang Busko
Adam: I would say that you do have a reliability problem. - check parts for solderability - check your board finish - check your profiles - check your paste - check your processes with focus on cleanliness - do some mechanical tests, you should rath
Electronics Forum | Fri Jan 03 11:42:38 EST 2003 | soupatech
Hi, I am loading a new board with mostly 0603 packages. The pads are .5 mm apart and I am having a big problem with parts shifting towards eachother instead of centering on the pads. I believe this is caused by too much solder. I am using a 7mil sten
Electronics Forum | Tue Dec 21 19:48:27 EST 1999 | Russ
John, we have waved 0603 packages for a long time, We have also started on 0402. Are you concerned with shorting across the component body or to other components? You should have no problems with these parts in a wave process. A couple of things
Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper
Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and
Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris
Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o
Electronics Forum | Sun Sep 10 14:43:59 EDT 2000 | David Harper
Just from my experience in seeing a problem like this is as follows The part has not been centered over the pads when placed, and during reflow the part is dragged over the the side with the most contact. Two, the parts are being dropped into the Pc
Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper
Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and
Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris
Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o
Electronics Forum | Tue Dec 21 18:09:24 EST 1999 | Brian W.
I have been soldering 0603 components on the bottom side using a glue and wave solder process for a long time. Bridging has not been a common problem. However, it is inherent on the design engineers to follow good manufacturability planning when la
Electronics Forum | Mon Nov 01 22:16:20 EST 1999 | chartrain
Your problem is common on this solder defect. It is sometimes known as squeeze balls. The formation of these result from excess volumes of paste applied to the pads. Once the paste melts and covers the pad and component termination,the excess has no
