Electronics Forum | Fri Feb 28 15:27:50 EST 2014 | tombstonesmt
Good afternoon! Looking to see what everyone else in the industry is running for print speeds regarding type 3 solder pastes. Our paste is a type 3 with 11.5% ROL0 flux content. The finest pitch component in our case is .5mm pitch. Our screen print
Electronics Forum | Thu Nov 09 20:01:12 EST 2006 | AB
What are the pros and cons between type 3 and type 4 no clean solder paste (SnPb)?
Electronics Forum | Wed Feb 09 13:41:48 EST 2005 | rkevin
Does anyone know the smallest pitch I can print succesfully with type 3 powder for a BGA ?
Electronics Forum | Thu Mar 23 06:38:30 EST 2006 | pavel_murtishev
Good afternoon, We can use type-3 solder paste, but what for? Type-3 solder particles are larger than type-4. Probably this will cause even worse release. BR, Pavel
Electronics Forum | Fri Nov 10 09:13:34 EST 2006 | russ
Dave hit the cons pretty well for type 4 type 4 is used when you have extremely small apertures and type 3 will not fit into them or release adequately basically. I have not yet had application that requires it but got very close once, .007 circle
Electronics Forum | Wed Feb 09 13:47:12 EST 2005 | rkevin
Does anyone know the smallest pitch I can print succesfully with type 3 powder for a BGA ?
Electronics Forum | Tue Mar 21 18:52:45 EST 2006 | GS
Ahoj Pavele, di you considered to try a Type-3 solder paste ? Best Regards...........GS
Electronics Forum | Fri Oct 04 01:18:27 EDT 2002 | sarge
1.5. Width >= 4-5 Particle Diameters. Use the smallest opening to determine this. Using dimension of the smallest aperture width, you should be able to fit minimum of 4-5 solder balls side by side into the opening. For 0201 design, -400 mesh (type
Electronics Forum | Thu Nov 07 09:23:05 EST 2002 | russ
What would the considerations be in utilizing a type 4 paste as opposed to type 3? We have an assembly that has a large amount of uBGAs (12 mil diam pad)along with 50 mil pitch BGAs assorted fine pitch etc... We are experiencing difficulty in paste
Electronics Forum | Wed Apr 09 09:44:12 EDT 2003 | iman
yes, we r profiling direct thermocouple attachment to the LGA pads. based on direct experience of yourself or others, what paste (brand/type3?/type4?/alloy?/flux%?) gives the optimal repeatable characteristic-patterns to minimize this defect?
