Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.
Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O
Electronics Forum | Sat Sep 08 08:55:24 EDT 2007 | davef
We expect to see a copper shadow along the edge of pads when soldering boards with organic solderability protection [OSP]. IPC-A-610 has defined this as acceptable for years. During early reflow stages, the flux in paste dissolves the OSP where ther
Electronics Forum | Thu Sep 06 22:01:21 EDT 2007 | syedsmt
Hi! I am Syed from Hitachi located in Malaysia.It seems that the discussion about OSP is very much related to the dillema that I am facing in my company.I am the Senior Executive for the SMT Department at Hitachi.Currently we are facing some issues w
Electronics Forum | Fri Sep 07 09:55:19 EDT 2007 | russ
what type of solder paste are you using? Why the concern over wetting spread to the edge of pads? Are the solderjoints formed correctly at the component? Russ
Electronics Forum | Sun Sep 09 22:57:05 EDT 2007 | syedsmt
Dear Members, Sorry,I might have not made myself clear on this issue and creating some confusion.Actually the problem faced is during the DIP Soldering process whereby one of the connector(IDE Pin) solder is cracked and lifted from the pattern.Visual
Electronics Forum | Sun Mar 23 13:39:39 EST 2003 | MA/NY DDave
Hi, From re reading, I think I did OK with my previous message yet I wanted to hit some other items, maybe differently. Without checking all the sources I don't believe there are any industry wide standards. I am sure and know there are industry
Electronics Forum | Thu May 26 13:53:45 EDT 2005 | gregp
I wouldn't worry about patents except for those types of feeders which have patents such as the MyData Agilis feeders. I would worry about cost of tooling for $tampings. Long time for ROI there. Also pay attention to the burr side and shear side of
Electronics Forum | Thu Nov 01 12:13:10 EST 2001 | jonathan
I guess this clarifies the defect more then looks at the process, but I�ll just through it out there for the sake of learning something new. If anyone would comment on this please feel free�. There are many different varieties of dewetting defects.
Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef
Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies
Electronics Forum | Tue Dec 14 15:58:17 EST 1999 | Curtis T
What is your board finish it sounds like an osp. That type of thing is common with osp finishes.
