Electronics Forum: ubga csp reliability on flexible circuit (Page 1 of 1)

ionic residues on the surface of printed circuit assemblies

Electronics Forum | Wed Sep 02 16:41:44 EDT 2009 | pcbcleaning

Advanced Cleaning Solutions is a Johnstown, PA based electronic manufacturing service provider (EMS) with more than 3,500 square feet of ESD safe facilities. Our services include precision PCB cleaning and ionic cleanliness testing/verification usin

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

Re: uBGA

Electronics Forum | Tue Oct 20 10:57:18 EDT 1998 | Craig Ramsey

Dear Bob, The Tessera microBGA technology defines a family of CSP devices. The most common microBGA type is the TV46 that has been selected by Intel for use with their flash memory devices. A microBGA package in general consists of the silicon die

Books Available to Review at SMTnet

Electronics Forum | Wed May 24 17:49:51 EDT 2000 | Keith Luke

SMTneters, The end of May finds several recent publications from leading publishers on my desk. I am all too happy to share these books with our loyal SMTneters in the hopes that they will provide us with a timely review of the new release. For ma

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

Air Bath Rework System

Electronics Forum | Wed Dec 22 14:21:13 EST 2004 | James Dornan of APE Inc

A little late but if this subject is still of interest the following paper from APE may be of interestwhen considering IR to Air Bath: HOT AIR versus IR and other convection Rework Systems HOT AIR is the most popularly chosen method of rework in th

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