Electronics Forum: ultra fine pitch bga (Page 1 of 33)

ultra sonic cleaning

Electronics Forum | Wed Jul 02 03:12:31 EDT 2003 | Joanna

We have been having problems with solder paste balls around fine pitch ICs and have decided that cleaning the boards in an ultra sonic cleaner may reomove these solder balls. However we are worried that the ultrasonic cleaning process may damage the

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr

My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone

super fine pitch paste & dispensing questions

Electronics Forum | Mon Aug 16 13:38:35 EDT 2010 | rl

i would like to request some advice on manually dispensing paste for super fine pitch components. first some background. i am a small design house and specialize in sub-miniature prototypes for avionics. so far, i have mostly used stainless steel st

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Mon Sep 08 01:45:35 EDT 2008 | rameshr

1.The Temperature on the pad is 247.C & also it is an lead free profile, the same profile we have used till last lot but we had obsereved this problem earlier to this current batch. 2. Both in Type3 & Type 4 paste we are using because of we are using

fine pitch/BGA component handling

Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg

Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part

fine pitch/BGA component handling

Electronics Forum | Wed Dec 18 20:08:36 EST 2002 | jonfox

Are your components not in JEDEC trays? We use Kostat trays and we can bake our parts at or up to 150C. What are your temperature requirements, and what are your parts currently being stored in or on? There are a slew of tray makers out there that

fine pitch/BGA component handling

Electronics Forum | Thu Dec 19 11:30:11 EST 2002 | russ

What temp. are you planning on baking them? If this is long term process I would recommend that you hav trays made out of an appropriate ESDS material that can withstand your bake temp (such as duropol)for your QFPs. You can have several patterns/pa

large bga (55mmx44mm) capable placement machines?

Electronics Forum | Thu Sep 09 04:45:02 EDT 2004 | Rob

Hi, Depends on where in the world you're based, but in the UK you can pick up a decent Universal GSM1 for around �12K-�15K ($20K-$27K). We place BGA's, huge fine pitch IC's, 72mm connectors etc with no problem. I believe they do up to 100mm feeder

BGA/Fine pitch footprints

Electronics Forum | Tue Mar 02 10:24:06 EST 2004 | russ

I have done this before, We print with a 5-6mil stencil and have had no problems with any underneath solder. If you are still nervous instead of removing from stencil use some 3 mil kapton tape or equivelant and tape off the BGA pads. This way the

BGA/Fine pitch footprints

Electronics Forum | Tue Mar 02 10:19:41 EST 2004 | loz

Hi all, we have recently seen a design that consists off a QFP100, pitch at 25". Also in the centre of this footprint is a FBGA165 footprint, pad size .4mm @ 1mm pitch. We have been informed that we will fit the QFP. I want to remove the BGA pads fr

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