Electronics Forum | Wed Apr 14 10:24:17 EDT 2010 | fönsi
Hello Does somebody of you have some experiences with ultrasonic detectors in SMT-Production? Is it possible to test quality of solder joints by using a ultrasonic detector similar to non destrucitve crack inspection tests? Is there a manufacturer fo
Electronics Forum | Fri Apr 16 11:36:33 EDT 2010 | fönsi
Thank you for the links. I didn't know that there are companys that build test systems for ultrasonic inspection. My idea was to use a ultrasonic detector similar to crack inspection, for example to detect if the cooling pad is melted, or a solder jo
Electronics Forum | Wed Apr 14 14:48:48 EDT 2010 | davef
It won't work. An acoustic signal can't punch through a BGA. The signals reflect at every interface. So, it works for flip chip, but there are too many interfaces in CSP and BGA. Equipment, Inspection, Acoustic microscope * MicroPhotonics * Sonos
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