Electronics Forum: under (Page 1 of 297)

Cleaning under LCC's

Electronics Forum | Wed Oct 04 16:21:52 EDT 2006 | russ

Cannot see you cleaning under this type of part with aqueous no matter what you try Russ

Coating under Mil connector....

Electronics Forum | Thu Dec 22 15:17:06 EST 2005 | jdumont

How is everyone coating under these connectors? Is RTV covering the outside so nothing can get in an answer? Or very thin silicone to wick under... http://img302.imageshack.us/img302/1728/dscn24450ac.jpg

Coating under Mil connector....

Electronics Forum | Tue Jan 03 17:36:49 EST 2006 | MikeF

If you know you have cleaned any flux residues that were under there you could consider a bead of an electronic grade RTV, such as RTV3145. If you trap any uncleaned residues under there you could have long term reliability problems. But, like Dave

Solder balls under LLP

Electronics Forum | Fri Aug 26 10:02:31 EDT 2005 | S vaughan

Hello, Can anyone comment on the implications of small sodler balls under a leadless device such as LLP with a centre thermal land. I believe that we did not make a good reduction and the paste squeezed out of the centre land and balled up under the

Wicking-solder found under mask

Electronics Forum | Thu Jul 12 20:53:59 EDT 2001 | davef

Hussman: Please help us understand how knowing the profile will point us in the direction of how solder got under solder mask.

Voiding under BGA's

Electronics Forum | Sun May 08 07:09:04 EDT 2005 | Rick Iodice

We are continuing to struggle with voids under BGA's. Our problem are not consistent. some CCA's are perfect but others have pin hole sized voids. Does anyone have any feedback on Indium 92j and how it performs for bga's?

Cleaning under LCC's

Electronics Forum | Tue Oct 17 21:59:47 EDT 2006 | jovial_guy23

Hi Steve, I agree with you that cleaning under LCC's is often difficult but its not impossible. In order to clean the residues, the most important thing to consider is the right compatibility of the fluxes with the cleaning chemistry. There are seve

Soldering under nitrogen atmosphere

Electronics Forum | Sat Jul 16 13:53:52 EDT 2022 | yannick_herzog

Hello all, we use a reflow oven from Rehm in our SMT production. At the moment we solder under nitrogen atmosphere (approx. 500ppm). Now we want to reduce the nitrogen consumption (costs etc.). What consequences can occur here? Especially on the s

Solder Ball under BGA

Electronics Forum | Wed Apr 28 14:58:39 EDT 2004 | davef

Solder ball acceptability: IPC-A-610, 6.5.3.1 & 12.4.10

Crystalized Flux under BGA

Electronics Forum | Wed Aug 04 17:14:39 EDT 2004 | arminski

Hi dave, how can I send the pix? Thanks, Dreamsniper

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