Electronics Forum | Tue Mar 29 03:03:42 EDT 2016 | wesleyintelli
Our MPM UP100 is not slowing the pcb carriage as it is brought under the stencil. The result is that the carriage jolts the machine heavily when it is fully loaded. The hall effect vane sensor half way along the rear rail is working correctly. The le
Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch
Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC
Electronics Forum | Thu Sep 01 09:05:47 EDT 2005 | russ
Thermal pads located underneath leadless devices require a 50% reduction in the stencil aperture.
Electronics Forum | Wed Aug 31 12:49:04 EDT 2005 | kmeline
I have been having the same problem with the LLP. I have three stencil I have done reduction on. The first I went by the manufacturing recommendations. The last two I have done more reducing for the thermal pad. The last one was at a 20% reduction an
Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.
I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a
Electronics Forum | Fri Oct 21 14:13:08 EDT 2005 | mafc65
1.- Clean bottom and top stencil with a cloth/alcohol at same time.Pay special attention to fine pitch locations. 2.- Clean again bottom stencil side .To prevent any residual of solder 3.- Blow air with a air gun under the stencil to remove the solde
Electronics Forum | Fri Dec 07 01:17:50 EST 2001 | Mike Konrad
The best suggestion one can offer is to view the archive section of this site. It is full of discussions, suggestions, advertising, claims, counter-claims, etc. Just search under the words �stencil cleaning�. Mike Konrad www.aqueoustech.com konrad
Electronics Forum | Thu Apr 11 19:12:11 EDT 2002 | djarvis
Sorry fellas -disagree. We only clean our stencils in the ultrasonic machine at the end of the run. If the same pcb is up the next day we clean them by hand. We use Electrolube SSS and the used rolls from the in line under stencil cleaner. Wipe the
Electronics Forum | Fri Jul 20 13:50:22 EDT 2018 | vchauhan
This question is regarding stencil design: I am having voids under QFN TI P/N LMZ20502SILT. I have attached component pic. Signal pin is 18X16 mils. Center pads are 31 mil sq. Initially I had stencil done with one mil per side reduction on signal pad
Electronics Forum | Fri Oct 14 14:09:19 EDT 2005 | bschreiber
Your problem is not the 0.4 pitch. Your problem is the manual cleaning. Manual cleaning will only remove the solder paste from the surface of the stencil. What's more, manual cleaning will force additional contamination into the 0.4 pitch apertures
