Electronics Forum: under stencil (Page 7 of 44)

OSP / Paste Printing Problems

Electronics Forum | Thu Aug 29 13:03:13 EDT 2002 | lysik

You have may have already checked this but verify stencil design (aspect ratio) and make sure you are using the correct paste (mesh size) Also look at perint pressure. up to 2 lbs per inch of blade used. You may also want to use a slow break away whe

MPM3000 vs 3050

Electronics Forum | Sat Dec 06 23:54:49 EST 2003 | Dean

3000 base model 3010 adds feature 3020 adds features 3030 adds features 3040 adds features 3050...top of the line Sorry I don't have the feature list. It's things like Environmental control unit, under stencil wiper, stencil exchanger, 2d inspe

Solventless Under Stencil Cleaning

Electronics Forum | Wed Feb 04 08:00:30 EST 2009 | milroy

Hi, It depends on the stencil thickness, aperture size and the component footprint. For exampl if you have a PCB with QFP,CSP,QFN & BGA parts then this underwiper is not useable because you will still find solder cream deposits in the apertures aft

MPM AP25, separation problems

Electronics Forum | Mon Oct 31 14:46:54 EST 2005 | valuems

Hello Did you just buy this machine on the used market? There is a possibility that the stencil is not height on all 4 corners ( from the center nest assembly. I don't under stand " the under stencil wiper is not working correctly". This is about

AP 25Hie

Electronics Forum | Mon Jan 12 17:00:43 EST 2004 | karkanov

Hi, We maybe buy a MPM AP25hie, and the guy who sold the printer told me about a Dedicated tooling and a Universal Tooling...I not quiet sur of what is that, can someone explain it to me and what is the best option. Just for fun are you ready t

pasteprinting D.O.E.

Electronics Forum | Tue Jun 04 22:46:21 EDT 2002 | davef

Factors to consider are: * Squeegee speed * Squeegee pressure * Separation speed * Stencil thickness * Stencil aperture fabrication method * Stencil aperture shape * Paste type * Stencil under-wipe frequency Search the fine SMTnet Archives for a thr

Finding a white strand on fine pitch components

Electronics Forum | Fri Aug 28 05:07:59 EDT 2009 | sachu_70

Do you clean the stencil manually or using the automated under-stencil cleaner on your Printer (recommended)? 1. Ensure that stencil wipes are lint-free and soaked sufficiently with solvent before use. 2. If your printer supports automated cleaning

Re: Squeegee Pressure

Electronics Forum | Tue Feb 16 08:54:57 EST 1999 | Ross Berntson

| I am fairly new to the SMT game and I am getting conflicting answers to the following. Maybe someone can help me! When printing, one person is telling me that the stencil should be wiped completely clean of all paste because the quality of the

Solder Ball on PCB pad after printing (DEK)

Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch

Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min

New Printer :- Dek Horizon 03i or MPM 125 ??

Electronics Forum | Wed Oct 08 01:43:24 EDT 2008 | pwilson1

Hi, Thanks for the replies! We currently use a mixture of DEK 265 LT`s and GSX`s. I ll be honest they are all around ten years old and i find them very reliable and easy to set up and maintain, with the only real issues we see now and again is w


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