Electronics Forum | Thu Nov 10 10:03:51 EST 2005 | C
Wow! that's amazing!, so you spray both sides, you wait for 2 minutes, and then you wipe everyting clean, and you do all this in 2 minutes, fantastic!
Electronics Forum | Wed Nov 09 09:01:42 EST 2005 | smtspecialist
I was using a combination of Alcohol and then compressed air for a while because I didn't wanted to add new hazardous chemicals into my factory but after looking into Vigon SC200 with a H/F/R of 0 I decided to try it. Since I started to use it, my
Electronics Forum | Fri Dec 06 13:00:29 EST 2002 | daanterstegge
I wouldn't recommend a metal squeegee, because if you can't wipe the step-etched area completely clean (that's the problem with metal) you'll have problems with the definition of the fine-pitch (it may stick in the holes). Best is a 70 Shore polyuret
Electronics Forum | Sat Feb 08 04:37:19 EST 2020 | spoiltforchoice
I work with small batches and this is what I do. However I don't do it because of the paste. Instead I do it because I am the sole operator on the line and I want one process finished so I can keep a better eye on the others. I specifically work with
Electronics Forum | Wed Mar 27 16:54:47 EST 2002 | davef
STARTING RANGES * Pressure � 1 pound/inch of blade (metal); 1.6-3 pound/inch (plastic) * Speed - 0.5 to 3 inch per sec [for standard pitch]; 0.5 to 1 inch per sec [for fine pitch] Your paste supplier�s recommendation is a good place to start. * Sepa
Electronics Forum | Mon Oct 22 13:21:12 EDT 2001 | Michael Konrad
Eric, The Kolb RB6D (and the RB5D) are not ultrasonic cleaners. They are high pressure spray cleaners. I would not recommend high pressure spray cleaners for misprinted assemblies with previously placed components (unless you don�t mind solder pas
Electronics Forum | Wed Aug 25 17:09:53 EDT 1999 | Earl Moon
| | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Co
Electronics Forum | Wed Aug 25 15:51:58 EDT 1999 | JohnW
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
Electronics Forum | Fri May 17 14:12:17 EDT 2002 | dason_c
Not now, Valor may under develop the module for its Trilogy 5000 with the stencil aperture based on the rules which you set. Also, check with IRI stencil (Alpha), they have a s/w and based on using ODB++ file and not Gerber. Rgds.
Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko
| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.
