Electronics Forum | Wed Oct 23 09:41:49 EDT 2002 | Antonio
Can anyone give me a ran down process on CSP? Is it like BGA process that needs reflow? what oven do I need...vapor, nitrogen or convection? is under fill a necessity? when and why do i have to under fill? when not to underfill and why? etc.... than
Electronics Forum | Tue Jun 20 10:51:47 EDT 2006 | Chunks
Under fill them.
Electronics Forum | Thu May 31 10:21:16 EDT 2001 | davef
On "Flip Chip/uBGA Under-fill Visual Standards" � The third "Satisfactory" [The under-fill if by design should be visible � ], here the notation "if by design" is unclear. Does "according to product documentation" get to the point? The first "Acc
Electronics Forum | Fri Aug 15 11:44:30 EDT 2003 | Hussman
Thanks for the info. Anyone know if there is a under fill required since this is a flip chip?
Electronics Forum | Wed Oct 05 15:31:44 EDT 2005 | chunks
Thanks Amol, You brought up some good ideas that we'll use. Has anyone ever heard of under filling the BGA (after reflow) with a material that cures, then thermal removing the BGA to check the acual size of the ball to pad?
Electronics Forum | Fri Jul 10 08:37:26 EDT 2009 | cyber_wolf
If they are under filled fids, take heavy duty two part epoxy and mix it with carbon powder from your copier. Use a razor blade to carefully trowel it in. We now use laser etched fids. They are much better.
Electronics Forum | Thu Jul 06 20:46:17 EDT 2000 | Dave F
Mark: An area of increasing interest to all of us. From the SMTnet "Terms & Definitions" (or whatever they call it) Globtop. Encapsulant. Encapsulating. Encapsulation. Potting. Enclosing an article in an envelope of adhesive or encapsulating co
Electronics Forum | Fri Dec 02 09:51:05 EST 2005 | whippingpost
I have an assembly that uses several different BGA packages. During troubleshooting we have found that some of the balls in the corners of the BGA's are separated from the underside of the package. The PWA is approx 10�x10� and the components vary fr
Electronics Forum | Mon Apr 15 18:59:12 EDT 2002 | davef
Points are: * Seminal study is: "Evaluation of Low Residue Soldering for Military and Commercial Applications: A Report from the Low Residue Soldering Task Force," published by Sandia National Labs in June 1995. Look here http://www.smtnet.com/forums
Electronics Forum | Wed Mar 27 21:20:30 EST 2002 | davef
There is two major BGA coating camps. * Camp #1: "We require the coating to be under low stand-off devices but with no filleting. So we apply a thinned dip coat first, and then top-off with a proper spray coat" * Camp #2: "We want no coating under th
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