Electronics Forum | Tue Jun 05 03:56:52 EDT 2001 | JohnW
Flip Chip/uBGA Underfill Visual Standards The aim of this document is to produce some draft text and then select photographs to make up a draft visual standard for inspection. There is also a need to produce some reference material for C Scan image
Electronics Forum | Thu Jun 26 08:49:21 EDT 2003 | caldon
Depends on your Material (Chemistry) and Machine. We use a hot plate with the material in an "L" patern. The Hot plate is used only in aiding the capillary action. Also, is time an issue?? Here is a good paper from Asymtek that was poster in Advan
Electronics Forum | Thu Dec 01 00:34:15 EST 2005 | pyramus
Guy's another question, how about any recommendation what type of adhesive to use as underfill for BGA during lead free process? Currently, we are only using Loctite 3609 & 3515 as adhesive we use 3515 as BGA underfill during normal leaded process s
Electronics Forum | Tue Jan 31 17:14:51 EST 2006 | Chris
I would not go by any general rules at all. Test the product! Thermal cycle it and shock and vib test it. Got burned on a part that had 0.010" dia bumps. Manufacturer stated undefill was not necessary on their part due to bump size. I wanted to u
Electronics Forum | Mon Feb 06 22:45:59 EST 2006 | pyramus
Hi everybody! Just want to ask some recommendation if which epoxy is advisable to be used for bonding and underfill for BGA's at Lead Free Process. Currently, we only used Loctite 3515 for high temp curing for leaded process. How about for Lead fre
Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef
UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Tue Sep 20 08:53:13 EDT 2011 | jocelynlauzon
My company is looking for an IPC expert consultant in BGA underfilling to support an important contract that is being prepared. We are looking for someone with hands-on experience with large (~2"x2", with as much as 1800 pin, 1mm pitch, 0.5mm ball di
Electronics Forum | Sun Jun 18 03:06:28 EDT 2000 | Frank
Thanks Paul, Where can I find Specs. on Vibration and drop testing?
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