Electronics Forum | Thu Sep 22 16:06:07 EDT 2011 | davef
Underfilling BGA is an uncommon practice. We'd start looking to find a consultant recommended by our: * Dispenser company * Underfill supplier
Electronics Forum | Tue Sep 20 08:53:13 EDT 2011 | jocelynlauzon
My company is looking for an IPC expert consultant in BGA underfilling to support an important contract that is being prepared. We are looking for someone with hands-on experience with large (~2"x2", with as much as 1800 pin, 1mm pitch, 0.5mm ball di
Electronics Forum | Thu Sep 22 14:54:01 EDT 2011 | hegemon
You might find a lot of experience in the forum here, but maybe not so many consultants for this niche. BGA underfill is not rocket science, and in my opinion, the key items are the material chracteristics, and the dispensing method and pattern. Fo
Electronics Forum | Fri Jun 08 07:52:13 EDT 2007 | zanolli
We are looking at a specialized method of direct soldering ceramic circuit modules (maybe 40mm square) to a mother board with solder joints on only 2 of the 4 sides. These modules would be oriented horizontally, or mezzanine like, to the mother board
Electronics Forum | Mon May 18 08:59:41 EDT 2009 | ozgurv
Dear All, Does anyone on the forum have experience with underfilling process of bga? We have a component with 0.5mm bga on one of the new products. Customer wants this component to have an underfill. Questions - 1) which kind of epoxy or chemica
Electronics Forum | Wed Mar 27 18:23:01 EST 2002 | kmorris
Does anyone have experience doing conformal coating over Plastic BGA in High-Rel PCB assembly? Is underfill necessary to avoid problems with entrapped air, etc? Our application is a 17x17mm BGA, 256 I/O. We are assembling with a water soluable pas
Electronics Forum | Tue May 19 06:57:33 EDT 2009 | cunningham
whats the reason for the underfill? we dont underfill any of our BGAs rework could be a issue if they need to be replaced? tried DP190?
Electronics Forum | Wed Jul 01 18:49:27 EDT 2009 | stevenlimth
1smtdude, I interested in your explaination of re-work an underfill part. You mention the material can be heated to a plastic state to become vicious... do you know usually what range is the temperate? (guess it can depend on the type/manufacturer o
Electronics Forum | Mon Apr 01 20:33:30 EST 2002 | davef
Regarding your underfil ... * What material did you use as an underfil? * What machine and technique did you use to apply the underfil? * What type of component were you underfilling? * What was the end-use environment?
Electronics Forum | Mon Apr 01 13:00:27 EST 2002 | BTaylor
We had a problem with conformal coating getting under an IC and with Temp. and vibration would cause cracking of the solder bump, underfill solved the problem.
