Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw
All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req
Electronics Forum | Tue Feb 21 10:58:02 EST 2012 | ppcbs
Can anyone suggest a good underfill compound that is readily available for manual dispensing. I need to underfill a small BGA less that 12mm square.
Electronics Forum | Fri Oct 29 07:35:42 EDT 2004 | Paddy
Hello all, I am looking at doing some trials with underfill under 1mm pitch BGA devices. Can anybody share any good / bad experience with this process ? Also I probably will not be in a position to procure automated equipment so are there any man
Electronics Forum | Mon May 18 08:59:41 EDT 2009 | ozgurv
Dear All, Does anyone on the forum have experience with underfilling process of bga? We have a component with 0.5mm bga on one of the new products. Customer wants this component to have an underfill. Questions - 1) which kind of epoxy or chemica
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Mon Jun 19 09:54:21 EDT 2000 | Paul Houston
Go to www.ipc.org and click on search. search for: IPC Test Methods Manual Section 6 IPC TM-650 Test Methods Manual SECTION 2.6 - ENVIRONMENTAL TEST METHODS Paul
Electronics Forum | Fri May 22 16:00:54 EDT 2009 | pjc
Henkel- Hysol seems to be the most popular material that I see: http://www.henkel.com/cps/rde/xchg/SID-0AC83309-B331D246/henkel_com/hs.xsl/12169_20090505-henkel-launches-next-gen-underfill-20681_COE_HTML.htm As far as application method, its all ab
Electronics Forum | Sat Jun 15 22:39:05 EDT 2002 | edahi
well we can't paste the flip chip on its substrate because we are using flux...because this bare die yet...and the surface of the die flipped might be contaminated...also after chip attach and reflow the die is to be underfilled and if the die is pas
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
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