Electronics Forum | Thu May 01 09:09:31 EDT 2008 | scottp
I looked at some no flow underfills about 5 years ago and they weren't quite ready for prime time yet. It's time to give it another look and I'm wondering if anyone is using them in production and how it's working. I'm looking at them for reducing
Electronics Forum | Thu May 01 09:11:28 EDT 2008 | ck_the_flip
Me too! Last time I evaluated these, voiding was a big problem. I wonder if the technology on these has advanced at all. Look forward to the forum responses (*rolling my eyes like a sarcastic Rodney Dangerfield*)
Electronics Forum | Thu May 01 09:26:53 EDT 2008 | scottp
Voiding was also the issue I had. I could reduce them substantially by pre-baking the boards, but that's obviously not desirable. Hopefully the chemists have come up with a solution. I extruded some pretty cool looking solder shorts through the vo
Electronics Forum | Mon Apr 01 20:33:30 EST 2002 | davef
Regarding your underfil ... * What material did you use as an underfil? * What machine and technique did you use to apply the underfil? * What type of component were you underfilling? * What was the end-use environment?
Electronics Forum | Mon Mar 29 14:29:50 EST 2004 | davef
Few people underfill PBGA. People underfill CCGA, uBGA, and FC. Consider a reworkable underfill on those devices that you expect to rework. Reworkable underfill candidates * Thermoset: ME526 (Red) * Loctite: 3567 (Cream) * Dexter: FP 4511 (Black)
Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw
All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req
Electronics Forum | Thu Sep 04 03:27:52 EDT 2008 | akareti
All, Does anyone have experience with underfill 300balls BGA connector? We have a component with 300balls BGA connector that connectorize with Flex. Customer wants to have an underfill Questions - Possibility for underfill 300balls BGA connector -
Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo
No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux
Electronics Forum | Tue Jul 26 08:57:23 EDT 2011 | indyc
I am trying to rework FP4531 underfill. Some of the underfill flowed to adjacent capacitor and resistor. Even though the datasheet says that it is non-reworkable, has anyone tried reworking / removing excess underfill? Any information would be help
Electronics Forum | Fri Sep 25 09:51:53 EDT 2020 | majdi4
I didn't understand your request.. Are you talking about underfill process (dispensing) or underfill with tape and reel packaging?? does the component drops at the 2nd reflow? that's why you want to go ahead for underfill process?? Thank you .
