Electronics Forum: underside cleaning (Page 1 of 4)

BGA underside cleaning

Electronics Forum | Thu May 07 08:31:13 EDT 1998 | Alan Pestell

We are about to use BGAs on our equipment. We clean all products prior to confomally coating them - to keep moisture off the IC legs. Will this be a problem with BGAs. Will we need to get the coating underneath the BGA or will the pitch on the balls

Re: BGA underside cleaning

Electronics Forum | Thu May 07 15:56:43 EDT 1998 | Terry Burnette

80ppm). The CTE of your board and solder joints will typically be 18-22ppm. We have seen cases were the coating fills the gap between the component and the board, then during temperature cycling the coating expands to the point of breaking the solder

Stencil cleaning

Electronics Forum | Wed Aug 16 13:31:30 EDT 2006 | a_laser

You can stop cleaning after a job when there is no more paste in the apertures. Under wiping should be done with a quality cloth and should leave no paste on the underside of the stencil (assures good contact on the next print and reduces chances of

stencil cleaning

Electronics Forum | Thu Apr 11 19:12:11 EDT 2002 | djarvis

Sorry fellas -disagree. We only clean our stencils in the ultrasonic machine at the end of the run. If the same pcb is up the next day we clean them by hand. We use Electrolube SSS and the used rolls from the in line under stencil cleaner. Wipe the

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef

Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we

DEK Horizon Underside Stencil cleaner

Electronics Forum | Wed Jan 30 21:56:47 EST 2008 | rayjr1491

On the DEK Horizon there are two options for underside cleaning one is a foam cleaner and paper cleaner that advances. The Foam cleaner cleans using liquid but does not increment and foam piece and can be washed but there are still contaminents. We h

Solder Wave Dross/Dirt

Electronics Forum | Mon May 26 10:40:25 EDT 2008 | aj

Hi , The dirt you are seeing are fibres from the wave solder pallet. Clean the underside of the pallets aswell as cleaning the Pot. aj...

Golden Finger contamination with Solder after reflow

Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef

Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p

Re: Micro balls on gold fingers

Electronics Forum | Tue May 19 12:29:59 EDT 1998 | Richard Jackson

| Richard, | You may be encountering solder paste contamination | on the assembly during the printing process. Solder | will reflow on tin/lead plated lands therefore invisible. | If you are washing the assembly prior to inspection | then you are

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