Electronics Forum | Thu Feb 14 20:24:07 EST 2002 | scott
My first reaction would be to run! FAST! Flex -- well, it... flexes... and isn't flat. While you assemble it, While you transport it, While it goes through the oven... SMT Connectors typically need to be held down during reflow. Fiducial types are
Electronics Forum | Thu Sep 02 02:30:08 EDT 2004 | Mike Konrad
Silverado, To answer your specific question, there are several manufacturers of batch-format cleaning systems. Aqueous Technologies www.aqueoustech.com Austin American www.aat-corp.com EMC www.emcgti.com UnitDesign www.unitdesign.com Each man
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Sun Apr 25 11:30:12 EDT 1999 | Earl Moon
| Hello all, | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profi
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
Electronics Forum | Tue Jul 18 09:29:54 EDT 2017 | svfeingold
That does sound like a great deal Tsvetan. Can you share any information about who/where exactly you purchased the machines, and which printer/reflow you have? I do have friends and colleagues in China that could ease the process if anything is comin
Electronics Forum | Fri Aug 20 14:19:47 EDT 1999 | Earl Moon
| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the
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