Electronics Forum: unit design mds 200 (Page 1 of 2)

Justification on buying machine (Reflow/Wave)

Electronics Forum | Mon Jun 19 13:56:59 EDT 2006 | netellink

Bolos, Why you have to purchase the Titanium solder pot for your lead-free? I have the MDS-200 Unit Design Drag solder and I just empty the solder SN63PB37 in the solder pot, clean it very well and buy lead-free solder bar to fill up the pot. David

How to strengthen the ability of anti-interference in PCB design

Electronics Forum | Thu Nov 20 04:02:02 EST 2014 | hhat

PCB layout of the circuit components, to meet the requirements of anti interference design: 1* arranged for each functional circuit unit in accordance with the circuit flow position, the layout of the signal for circulation, and make the signal as m

low volume /semi-automatic solutions

Electronics Forum | Tue Jun 17 13:12:57 EDT 2003 | Jipp

We designed small PCBs (typically 2"x5")for our some of our products for quite some time now. We did not use PCB extensively and just hand-produced everything but... We now use them more and more and they got more sophisticated. we're heading for 20

PCB post reflow cleaning

Electronics Forum | Sun Mar 28 22:17:36 EST 2004 | Grant Petty

Hi, I would also be interested in this thread, but our problem has a different twist to it. We have good results from our reflow with Koki no clean paste, however when we pass the boards through the wave solder machine, the flux in that leaves a fog

Ultra low cost pick & place?

Electronics Forum | Tue May 13 08:47:38 EDT 2008 | locostpp

Yes, this is a good point and really only time will tell just how reliable such a machine becomes. What I'm aiming for is to simplify and reduce the number of sub-assemblies. For example we are building the camera/vision processor and lighting into

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: AOI

Electronics Forum | Wed Apr 21 09:35:48 EDT 1999 | Wade Oberle

| | I had someone suggest that they weren't really necessary as long as your process is good. Is this just a way to help you keep an eye on your process? | | | | I was thinking, as we set up our line, our money would be more well spent with control

Re: IR rework stations

Electronics Forum | Tue Sep 28 08:55:21 EDT 1999 | Earl Moon

| | | | | | | | | | | Hiya, | | | | | | | | | | | | | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | | | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | | | | | | | | | | |

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

Re: No Free Beer But...

Electronics Forum | Sat Oct 17 10:24:12 EDT 1998 | smd

| | | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | | Q: Can yo

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