Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand
Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.
Electronics Forum | Sat Jan 22 16:39:26 EST 2011 | eadthem
Your typical high mix line would consist of, Stencil printer, 1-2 foot conveyor belt, fast PNP machine (say a universal 30 spindle turret lightning head), 1-2 foot conveyor belt, large/heavy part PNP (say a universal flex jet 7 spindle or 4 Spindle),
Electronics Forum | Sun Mar 04 01:56:37 EST 2012 | eadthem
What we have had recently is a lot of larger thin (32 thou) thickness boards that have had issues with SC90 diodes bouncing off the pads in the final PNP machine. Our setup, universal instruments GC120 or quad beam 30 spindle lightning heads. This m
Electronics Forum | Thu Aug 27 15:40:50 EDT 1998 | Justin Medernach
| | | | | Hi, | | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | | We have rule out the possibility of not p
Electronics Forum | Wed Jun 11 16:30:33 EDT 2003 | T.Vick
You have received some great feedback so far. I would like to summarize and add a few points regarding maintenance. You should start (as recommended already) by verifying your component library data. Using the default values from the master library i
Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel
This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********
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